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MC74HC595AFEL

Onsemi

MC74HC595AFEL by Onsemi

MC74HC595AFEL by Onsemi is an 8-bit digital shift register with a propagation delay of 210 ns. It operates at a supply voltage range of 2-6V and has a max frequency of 20MHz. Ideal for applications requiring true output polarity, such as military-grade temperature-sensitive devices.

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ACDS - Activité Composants Distribution Service

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Classic Components Corporation

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AZTECH Wire

Italy . 340 parts In-Stock

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Advanced Electronics

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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TANS Electronics

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Overview

Enhance your digital shift register applications with the MC74HC595AFEL by Onsemi. This high-quality product offers a range of benefits, including a small outline package style for easy integration, 3-state output characteristics for versatile functionality, and a wide operating temperature range from -55 to 125 °C. With a true output polarity and positive edge trigger type, this shift register provides reliable performance and precise control in various electronic systems. Trust in Onsemi's reputation for excellence and elevate your projects with the MC74HC595AFEL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the shift register, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto a PCB, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits, this shift register can handle a range of data processing tasks efficiently.

Nominal Supply Voltage / Vsup (V): 3

Operating at a low nominal supply voltage of 3V makes the shift register suitable for power-efficient applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the shift register to function reliably in a wide range of environments.

Output Characteristics: 3-STATE

The 3-STATE output feature enables the shift register to actively drive outputs, tri-state outputs, or remain in a high-impedance state, adding flexibility to the design.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high noise immunity, making the shift register a reliable and efficient choice.

Technical Specifications

Digital Shift Registers MC74HC595AFEL attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC595AFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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