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MC74HC589AFELG

Onsemi

MC74HC589AFELG by Onsemi

MC74HC589AFELG by Onsemi is an 8-bit digital shift register with a propagation delay of 275 ns. It operates at a nominal voltage of 3V and supports a max frequency of 20 MHz. Ideal for military-grade applications requiring positive edge triggering and true output polarity in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,121 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 1,015 parts In-Stock

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Problanco Electronics

Mexico . 8,294 parts In-Stock

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TANS Electronics

Latvia . 7,254 parts In-Stock

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Kulean Microsystems

USA . 6,305 parts In-Stock

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Microchip USA

USA . 5,353 parts In-Stock

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SupplyDigital Components

Austria . 4,824 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 318 parts In-Stock

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Corohmni

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Overview

Discover the Onsemi MC74HC589AFELG, a top-quality digital shift register that offers unparalleled performance and reliability. Manufactured by Onsemi, a renowned leader in the industry, this product is designed to meet the highest standards of excellence. Ideal for a wide range of applications, this versatile component provides customers with exceptional value and numerous benefits. Experience seamless operation, efficient data transfer, and superior functionality with the MC74HC589AFELG by Onsemi. Elevate your projects to the next level with this exceptional digital shift register.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the shift register.

No. of Bits: 8

With 8 bits, this shift register allows for the storage and shifting of 8 binary digits, providing flexibility in data processing.

Nominal Supply Voltage / Vsup (V): 3

The low nominal supply voltage of 3V makes this shift register energy-efficient and suitable for low-power applications.

Propagation Delay (tpd): 275 ns

The low propagation delay of 275 ns ensures fast data processing and efficient operation of the shift register.

Maximum Frequency At Nominal Supply: 20000000 Hz

With a maximum frequency of 20 MHz at the nominal supply voltage, this shift register can handle high-speed data transmission and processing.

Technical Specifications

Digital Shift Registers MC74HC589AFELG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

275 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC589AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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