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MC33269DT-012

Onsemi

MC33269DT-012 by Onsemi

MC33269DT-012 by Onsemi is a fixed positive single output LDO regulator with 12V nominal output voltage and 0.8A max output current. It has a small outline package style, Gull Wing terminal form, and operates in temperatures ranging from -40 to 150 °C. Ideal for applications requiring stable voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,351 parts In-Stock

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Digiode

USA . 1,035 parts In-Stock

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AZTECH Wire

Italy . 1,095 parts In-Stock

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Problanco Electronics

Mexico . 5,425 parts In-Stock

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Kulean Microsystems

USA . 4,882 parts In-Stock

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SupplyDigital Components

Austria . 3,506 parts In-Stock

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TANS Electronics

Latvia . 3,459 parts In-Stock

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Microchip USA

USA . 345 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Corohmni

South Africa . 200 parts In-Stock

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Corphita

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Overview

Discover the MC33269DT-012 by Onsemi, a top-of-the-line Fixed Regulator that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this LDO regulator is perfect for a variety of applications. With a nominal output voltage of 12V and maximum dropout voltage of only 1.35V, this product ensures stable power supply with minimal energy loss. Its compact design and high-quality materials make it an ideal choice for any project. Upgrade your devices with the MC33269DT-012 and experience the difference in efficiency and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Maximum Dropout Voltage-1: 1.35 V

Low dropout voltage ensures efficient power conversion and minimal power loss, making the regulator highly efficient.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on printed circuit boards, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range up to 150 °C ensures reliable performance in various environmental conditions.

Technology: BIPOLAR

Bipolar technology provides stable and accurate voltage regulation, making the product suitable for precision applications.

Minimum Output Voltage-1: 11.76 V

The minimum output voltage ensures compatibility with devices that require lower operating voltages while still providing a stable 12V output.

Nominal Output Voltage-1: 12 V

The nominal 12V output voltage is ideal for powering a variety of electronic components, ensuring consistent performance.

Maximum Voltage Tolerance: 2 %

The tight voltage tolerance of 2% ensures precise voltage regulation, making the product suitable for applications that require stable power supply.

Maximum Output Current-1: 0.8 A

The high output current of 0.8A allows the regulator to power multiple components or devices simultaneously, increasing its versatility.

Maximum Load Regulation: 0.06 %

Low load regulation ensures a consistent output voltage regardless of changes in the load, making the regulator reliable for varying power requirements.

Technical Specifications

Fixed Regulators - Positive Single Output LDO MC33269DT-012 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.35 V

Nominal Dropout Voltage-1:

1.1 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

20 V

Minimum Input Voltage:

13.5 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Length:

6.54 mm

Maximum Line Regulation:

.036 %

Maximum Load Regulation:

.06 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

12.24 V

Minimum Output Voltage-1:

11.76 V

Nominal Output Voltage-1:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

2 %

Width:

6.095 mm

Trade Compliance

MC33269DT-012 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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