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MC14536BDW

Onsemi

MC14536BDW by Onsemi

MC14536BDW by Onsemi is a CMOS TIMER with 16 terminals, operating b/w -55 to 125 °C. It has a clock frequency of 2 MHz and supports supply voltage range from 3V to 18V. Ideal for military applications requiring programmable timing functions in compact spaces.

Median Price

$2.880

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 30 parts In-Stock

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Vyrian

USA . 2,427 parts In-Stock

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Bristol Electronics

USA . 587 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

USA . 454 parts In-Stock

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A2Z Electronics, Inc.

USA . 338 parts In-Stock

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Odintec Ltd.

Israel . 145 parts In-Stock

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145

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QIE Inc.

USA . 80 parts In-Stock

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80

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PC Components Company LLC

USA . 30 parts In-Stock

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Resion

USA . 22 parts In-Stock

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Inland Empire Components Inc.

USA . 3 parts In-Stock

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Corohmni

South Africa . 137 parts In-Stock

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SupplyDigital Components

Austria . 4,914 parts In-Stock

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Kulean Microsystems

USA . 4,009 parts In-Stock

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Problanco Electronics

Mexico . 3,285 parts In-Stock

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Perfect Parts

USA . 2,043 parts In-Stock

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TANS Electronics

Latvia . 1,779 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,288 parts In-Stock

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Corphita

USA . 1,041 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 457 parts In-Stock

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Overview

Unleash the power of precise timing and real-time clock functions with the MC14536BDW by Onsemi. Crafted with quality materials and cutting-edge technology, this timer and programmable IC offers unmatched reliability and accuracy for a wide range of applications. Whether you're designing automotive systems, consumer electronics, or industrial equipment, this compact and versatile component provides the value and benefits you need to stay ahead of the competition. Trust Onsemi to deliver exceptional performance and efficiency with the MC14536BDW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the timer, ensuring a long lifespan.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 18 V

Supports a wide range of voltage inputs, making the timer versatile and compatible with various systems.

Minimum Supply Voltage: 3 V

Can operate efficiently with low voltage inputs, making it suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, ensuring reliable performance in harsh conditions.

Minimum Operating Temperature: -55 °C

Capable of operating in extremely cold temperatures, making it suitable for a wide range of environments.

Technology: CMOS

Utilizes low power consumption and high noise immunity, making it efficient and reliable for timekeeping applications.

Technical Specifications

Timers & Real-Time Clocks MC14536BDW attributes and parameters. Explore more Timers & Real-Time Clocks devices from Onsemi

Specs

Maximum Clock Frequency:

2 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

No. of Terminals:

16

No. of Timers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

MC14536BDW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5910-01-397-9893, 5910013979893

NIIN

013979893

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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