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MC14511BFL2

Onsemi

MC14511BFL2 by Onsemi

MC14511BFL2 by Onsemi is a CMOS Graphics Display Driver with 16 terminals, operating at -55 to 125 °C. It supports 7 segments, with power supplies of 5/15V and surface mount capability. Ideal for military-grade applications requiring segment display drivers in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 985 parts In-Stock

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Vyrian

USA . 176 parts In-Stock

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SupplyDigital Components

Austria . 6,653 parts In-Stock

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TANS Electronics

Latvia . 3,587 parts In-Stock

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Problanco Electronics

Mexico . 2,349 parts In-Stock

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Kulean Microsystems

USA . 1,579 parts In-Stock

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Corphita

USA . 424 parts In-Stock

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UHIMA Technologies

Türkiye . 404 parts In-Stock

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Corohmni

South Africa . 104 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the MC14511BFL2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Graphics Display Drivers that cater to a wide range of applications. This product offers exceptional value with its high-performance capabilities, making it ideal for various electronic devices. Trust Onsemi to provide cutting-edge technology that exceeds expectations, ensuring seamless functionality and enhanced user experience. Choose the MC14511BFL2 for unmatched benefits and advantages that elevate your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the display driver, making it suitable for various operating conditions.

Display Mode: SEGMENT

The segment display mode allows for clear and easy-to-read visual information, making the display driver suitable for applications where segmented display is required.

Surface Mount: YES

Being surface mount allows for easy and efficient installation of the display driver onto a circuit board, saving time and effort during assembly.

Power Supplies (V): 5/15

The display driver can operate on both 5V and 15V power supplies, providing flexibility in power requirements for different applications.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and interfaces, expanding the possibilities for connecting the display driver to other components in a system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making the display driver suitable for applications where size constraints are a concern.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the display driver can withstand high temperature environments, ensuring reliability and performance.

Minimum Operating Temperature: -55 °C

The display driver can operate in cold temperature conditions as low as -55 °C, making it suitable for a wide range of operating environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, ensuring secure connections and reliable performance of the display driver.

Temperature Grade: MILITARY

The military temperature grade indicates that the display driver meets high standards for reliability and performance in demanding military applications.

Technology: CMOS

The CMOS technology used in the display driver allows for low power consumption and high noise immunity, making it energy-efficient and reliable in operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance of the display driver.

No. of Segments: 7

With 7 segments, the display driver can support various types of displays and visual information, making it versatile for different applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and accurate connections, ensuring reliable performance and functionality of the display driver.

Technical Specifications

Graphics Display Drivers MC14511BFL2 attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Additional Features:

COMMON-CATHODE

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MC14511BFL2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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