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MC14060BCPG

Onsemi

MC14060BCPG by Onsemi

MC14060BCPG by Onsemi is a 14-bit digital counter with a propagation delay of 740 ns. Operating at temperatures from -55 to 125 °C, it has a max frequency of 3.5 MHz and is ideal for military-grade applications requiring asynchronous operation in CMOS technology.

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Holdelec - ElecDif-Pro

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Classic Components Corporation

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AZTECH Wire

Italy . 366 parts In-Stock

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$18.289

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Ampacity Inc.

Singapore . 985 parts In-Stock

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Aztec Data Supply Inc.

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Semicontronic

India . 983 parts In-Stock

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Overview

Enhance your digital projects with the MC14060BCPG by Onsemi, a top-quality digital counter that offers precision and reliability. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications. With its advanced technology and high-performance capabilities, customers can expect seamless operation and accurate results. Say goodbye to performance issues and hello to efficiency with the MC14060BCPG. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

No. of Bits: 14

With 14 bits, this digital counter can count up to 16,384 different values, offering high precision in counting applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources, ensuring easy integration into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the digital counter to function reliably in various environmental conditions without overheating.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making the digital counter energy-efficient and reliable in noisy environments.

Technical Specifications

Digital Counters MC14060BCPG attributes and parameters. Explore more Digital Counters devices from Onsemi

Specs

Count Direction:

UP

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Load or Preset Input:

NO

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

Operation Mode:

ASYNCHRONOUS

No. of Bits:

14

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

740 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

12 MHz

Trade Compliance

MC14060BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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