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MC10EP33DTR2G

Onsemi

MC10EP33DTR2G by Onsemi

MC10EP33DTR2G by Onsemi is a Prescaler & Multivibrator with 3.3V supply, 0.44ns propagation delay, and 4GHz max frequency. Ideal for industrial applications requiring high-speed signal processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,253 parts In-Stock

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Digiode

USA . 523 parts In-Stock

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523

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Distributors (Availability)

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AZTECH Wire

Italy . 934 parts In-Stock

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$9.620

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934

$9.620

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QUARKTWIN TECHNOLOGY LTD

USA . 14,231 parts In-Stock

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Kulean Microsystems

USA . 7,418 parts In-Stock

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Problanco Electronics

Mexico . 7,283 parts In-Stock

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TANS Electronics

Latvia . 4,992 parts In-Stock

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SupplyDigital Components

Austria . 3,273 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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Corphita

USA . 1,447 parts In-Stock

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Kepictronics

USA . 1,020 parts In-Stock

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Corohmni

South Africa . 401 parts In-Stock

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UHIMA Technologies

Türkiye . 189 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the MC10EP33DTR2G from Onsemi, a leading manufacturer in the industry. This Prescaler & Multivibrator offers unmatched precision and reliability, making it ideal for a wide range of applications. With its compact design and advanced technology, this product delivers superior performance while maximizing efficiency. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the MC10EP33DTR2G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the components inside, ensuring a reliable product for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact spaces where through-hole mounting may not be feasible.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is a common power requirement in many electronic applications, making this product compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high heat conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures functionality in a variety of environments, including extreme cold conditions.

Maximum Frequency At Nominal Supply: 4000000000 Hz

The high maximum frequency capability of 4 GHz allows for fast signal processing, making this product suitable for high-speed applications.

Technology: ECL

Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption, making this product efficient and suitable for advanced electronic systems.

Technical Specifications

Prescaler & Multivibrators MC10EP33DTR2G attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Data/Clock Inputs:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

34 mA

Propagation Delay (tpd):

.44 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC10EP33DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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