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MC100LVEL33DTR2

Onsemi

MC100LVEL33DTR2 by Onsemi

MC100LVEL33DTR2 by Onsemi is a Prescaler & Multivibrator with 8 terminals and ECL technology. It operates at a max frequency of 3.4 GHz, has a propagation delay of 0.82 ns, and requires a supply voltage b/w 3-3.8V. Ideal for industrial applications requiring high-speed signal processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,431 parts In-Stock

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Prism Electronics

USA . 2,495 parts In-Stock

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Digiode

USA . 1,492 parts In-Stock

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AZTECH Wire

Italy . 211 parts In-Stock

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$16.940

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Problanco Electronics

Mexico . 6,563 parts In-Stock

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TANS Electronics

Latvia . 4,242 parts In-Stock

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Perfect Parts

USA . 2,794 parts In-Stock

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Kulean Microsystems

USA . 2,610 parts In-Stock

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SupplyDigital Components

Austria . 1,755 parts In-Stock

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UHIMA Technologies

Türkiye . 618 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 363 parts In-Stock

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Corphita

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Kepictronics

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Overview

Discover the cutting-edge MC100LVEL33DTR2 by Onsemi, a high-quality Prescaler & Multivibrator component that offers exceptional performance and reliability. Manufactured by industry leader Onsemi, this product is designed for a wide range of applications, providing customers with unparalleled value and benefits. With a small outline, thin profile package and a maximum frequency of 3.4 GHz, this versatile component is perfect for industrial settings, ensuring optimal functionality and efficiency. Trust Onsemi to deliver top-of-the-line solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost-effectiveness and durability, making the product suitable for a variety of applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, compatible with many electronic systems.

Propagation Delay (tpd): 0.82 ns

Provides fast signal processing capabilities, enhancing the overall performance of the product.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying temperature conditions.

Maximum Frequency At Nominal Supply: 3400000000 Hz

Supports high-frequency operation, making it ideal for applications that require fast signal processing.

Technical Specifications

Prescaler & Multivibrators MC100LVEL33DTR2 attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3400000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay (tpd):

.82 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Minimum fmax:

3800 MHz

Trade Compliance

MC100LVEL33DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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