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MARS1-AR0220AT3-GEVB

Onsemi

MARS1-AR0220AT3-GEVB by Onsemi

MARS1-AR0220AT3-GEVB by Onsemi is an Image Sensor Evaluation Board with 1.7MP sensing range and 60fps sensitivity. It utilizes AR0220AT IC, features a serial interface, and comes in bulk packaging. Ideal for developing image sensor applications efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,511 parts In-Stock

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Digiode

USA . 790 parts In-Stock

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AZTECH Wire

Italy . 567 parts In-Stock

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$11.640

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TANS Electronics

Latvia . 2,694 parts In-Stock

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Problanco Electronics

Mexico . 2,611 parts In-Stock

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SupplyDigital Components

Austria . 1,937 parts In-Stock

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Kulean Microsystems

USA . 1,823 parts In-Stock

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Corphita

USA . 1,144 parts In-Stock

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UHIMA Technologies

Türkiye . 560 parts In-Stock

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Corohmni

South Africa . 51 parts In-Stock

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Overview

Discover the endless possibilities with the MARS1-AR0220AT3-GEVB by Onsemi. This innovative sensor evaluation board offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. Whether you're working on image processing, machine vision, or IoT projects, this development board is sure to exceed your expectations. With its high sensitivity and impressive sensing range, the MARS1-AR0220AT3-GEVB provides exceptional value and benefits to customers looking to take their projects to the next level. Trust Onsemi to deliver cutting-edge solutions that push the boundaries of technology.

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers / Evaluation Boards / Sensor Evaluation Boards

This product falls under the category of development boards and sensor evaluation boards, making it ideal for testing and evaluating image sensors.

Packaging: Bulk

Bulk packaging enables cost-effective purchase of multiple units, suitable for larger-scale projects or testing scenarios.

Sensor Type: Image Sensor

The use of an image sensor ensures high-quality image capture and processing capabilities for various applications.

Sensing Range: 1.7 Megapixel

With a high sensing range of 1.7 megapixels, this board can capture detailed images with clarity and precision.

Interface: Serial

Serial interface allows for easy communication and integration with other devices or systems, enhancing connectivity options.

Sensitivity: 60fps

High sensitivity of 60 frames per second (fps) ensures smooth and real-time image processing, beneficial for applications requiring quick response times.

Supplied Contents: Board(s)

The inclusion of the board(s) in the package provides all necessary components for immediate setup and use, saving time and effort for developers.

Utilized IC / Part: AR0220AT

The utilization of the AR0220AT IC/part indicates a high-performance and reliable component, ensuring optimal functionality and performance of the board.

Base Product Number: MARS1

Being a part of the MARS1 product line further establishes the quality and compatibility of this board with other related products or accessories.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL rating of 1 (Unlimited) indicates high durability and resistance to moisture, making the board suitable for a range of environmental conditions.

Technical Specifications

Additional Parts MARS1-AR0220AT3-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

MARS1-AR0220AT3-GEVBOS

Sensitivity:

60fps

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0220AT

Sensing Range:

1.7 Megapixel

Interface:

Serial

Standard Package:

1

Base Product Number:

MARS1

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MARS1-AR0220AT3-GEVB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8525.89.3000

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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