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LV5710GP-TE-L-H

Onsemi

LV5710GP-TE-L-H by Onsemi

LV5710GP-TE-L-H by Onsemi is a VOLTAGE-MODE Power Management IC with 2300 kHz switching frequency, 0.03 A output current, and BICMOS technology. Ideal for POWER SUPPLY SUPPORT CIRCUIT applications in commercial extended temperature range from -20 to 80 °C.

Median Price

$1.398

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 188,000 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

188,000

-

$1.320

$1.180

$1.110

Verical

USA . 186,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.387

186,000

-

-

$1.475

$1.387

Distributors (In-Stock)

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Digiode

USA . 532 parts In-Stock

1+ parts

$1.387

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-

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532

$1.387

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Vyrian

USA . 6,607 parts In-Stock

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6,607

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Distributors (Availability)

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Ampacity Inc.

Singapore . 187,705 parts In-Stock

1+ parts

$1.240

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187,705

$1.240

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Corphita

USA . 778 parts In-Stock

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$1.314

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778

$1.314

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Corohmni

South Africa . 242 parts In-Stock

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$1.460

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242

$1.460

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AZTECH Wire

Italy . 1,025 parts In-Stock

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$9.440

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1,025

$9.440

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QUARKTWIN TECHNOLOGY LTD

USA . 10,082 parts In-Stock

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10,082

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Kulean Microsystems

USA . 7,443 parts In-Stock

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7,443

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SupplyDigital Components

Austria . 6,625 parts In-Stock

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6,625

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Problanco Electronics

Mexico . 1,923 parts In-Stock

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1,923

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Kepictronics

USA . 1,123 parts In-Stock

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Metaverse IC Inc.

Canada . 975 parts In-Stock

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975

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RC Electronics

USA . 800 parts In-Stock

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800

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UHIMA Technologies

Türkiye . 497 parts In-Stock

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497

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TANS Electronics

Latvia . 374 parts In-Stock

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374

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Microchip USA

USA . 294 parts In-Stock

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294

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Overview

Looking for reliable power management ICs? Look no further than the LV5710GP-TE-L-H by Onsemi! With a reputation for high-quality products, Onsemi delivers cutting-edge solutions for various applications. The LV5710GP-TE-L-H offers customers unparalleled value and benefits with its advanced technology and impressive features. Whether you're in need of power supply support circuits or voltage-mode control, this IC has got you covered. Trust Onsemi to provide you with the best in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the circuit board.

No. of Terminals: 12

Having 12 terminals allows for more connectivity options, enabling versatile usage.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection and efficient heat dissipation for the IC.

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures the product can withstand demanding environmental conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control mode provides precise voltage regulation, enhancing performance and efficiency.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows reliable operation even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position enables easy and secure connections, reducing installation time.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit IC type, this product enhances the stability and efficiency of power management.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures the product can be used in a wide range of commercial applications.

Maximum Switching Frequency: 2300 kHz

High maximum switching frequency provides fast response times, crucial for efficient power management.

Maximum Output Current: 0.03 A

A maximum output current of 0.03A allows the product to handle moderate power requirements.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

No lead terminal form enhances reliability and minimizes the risk of solder joint failures.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm enables high-density mounting, making the product suitable for compact designs.

Technical Specifications

Power Management ICs LV5710GP-TE-L-H attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

S-PQCC-N12

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

12

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.03 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

2300 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV5710GP-TE-L-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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