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LM833NG

Onsemi

LM833NG by Onsemi

LM833NG by Onsemi is a dual operational amplifier with 8 terminals in an inline package. It features a peak reflow temperature of 260°C and operates at an industrial temperature grade. This bipolar technology op amp is commonly used in audio applications due to its high performance and reliability.

Median Price

$0.266

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$0.266

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Chip Stock

USA . 59,000 parts In-Stock

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59,000

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Digiode

USA . 2,441 parts In-Stock

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Vyrian

USA . 2,367 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.266

100+ parts

-

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$0.253

10k+ parts

$0.247

1,000

$0.266

-

$0.253

$0.247

Ampacity Inc.

Singapore . 1,438 parts In-Stock

1+ parts

$0.410

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1,438

$0.410

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AZTECH Wire

Italy . 317 parts In-Stock

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$10.824

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317

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Perfect Parts

USA . 5,624 parts In-Stock

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Microchip USA

USA . 3,357 parts In-Stock

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Problanco Electronics

Mexico . 2,776 parts In-Stock

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Kulean Microsystems

USA . 2,701 parts In-Stock

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TANS Electronics

Latvia . 1,961 parts In-Stock

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SupplyDigital Components

Austria . 1,269 parts In-Stock

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UHIMA Technologies

Türkiye . 597 parts In-Stock

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Corphita

USA . 574 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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Kepictronics

USA . 33 parts In-Stock

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Overview

Experience high-quality audio performance with the LM833NG operational amplifier by Onsemi. This versatile component offers dual functions in a compact rectangular package, making it ideal for a wide range of applications. From audio amplification to signal processing, this industrial-grade bipolar technology ensures reliability and precision in every use. Trust Onsemi's reputation for excellence and choose the LM833NG for superior sound quality and seamless integration into your projects. Elevate your designs with the value and benefits that this exceptional operational amplifier provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good insulation properties and can withstand a wide range of temperatures, making the op amp durable and reliable in various operating conditions.

No. of Functions: 2

Having 2 functions in one package allows for more complex circuit designs without the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

A rectangular shape is common and easy to handle, allowing for convenient PCB layout and assembly.

No. of Terminals: 8

With 8 terminals, there are more connection points available for input and output signals, enabling versatile circuit configurations.

Terminal Finish: Tin (Sn)

Tin finish provides good solderability, ensuring secure and reliable connections during assembly.

Terminal Position: DUAL

Dual terminal position simplifies PCB layout and ensures proper alignment during installation, reducing assembly time and errors.

Maximum Seated Height: 5.33 mm

Low seated height allows for compact design and easy integration into space-constrained applications.

Width: 7.62 mm

Narrow width enables close placement of components on the PCB, optimizing board space and facilitating efficient circuit layout.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and leads to better overall product quality during manufacturing.

Length: 9.27 mm

A moderate length facilitates handling and installation while maintaining a compact form factor for space-saving designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this op amp can operate effectively in harsh environments with extended temperature ranges.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, suitable for demanding signal processing requirements in various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and secure connections, ideal for applications that require robust solder joints.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is versatile and commonly used in amplification, signal processing, and feedback control circuits for various applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy component placement and soldering, enhancing manufacturing efficiency and compatibility with standard PCB practices.

Technical Specifications

Operational Amplifiers (Op Amps) LM833NG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.365 in (9.27 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.21 in (5.33 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Trade Compliance

LM833NG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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