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LM317MBDT-1

Onsemi

LM317MBDT-1 by Onsemi

LM317MBDT-1 by Onsemi is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from -40 to 125 °C, making it suitable for various applications requiring precise voltage regulation in electronic circuits.

Median Price

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Lifecycle Status

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1k+

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Digiode

USA . 2,222 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 7,110 parts In-Stock

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TANS Electronics

Latvia . 4,772 parts In-Stock

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Problanco Electronics

Mexico . 1,583 parts In-Stock

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Corphita

USA . 818 parts In-Stock

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UHIMA Technologies

Türkiye . 743 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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SupplyDigital Components

Austria . 106 parts In-Stock

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Overview

Unlock the power of precision with the LM317MBDT-1 by Onsemi. This adjustable regulator offers unparalleled quality and reliability, backed by Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this regulator provides stable output voltages with minimal input-output differentials. Experience the value and benefits of seamless operation in a compact package that is designed to enhance performance and efficiency. Elevate your projects with the LM317MBDT-1 and discover the advantages of using top-of-the-line technology from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat, making the regulator suitable for various operating conditions.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand heat and perform reliably in harsh environments.

Maximum Input-Output Voltage Differential: 40 V

The wide voltage differential allows for flexibility in input and output voltage requirements, making this regulator versatile for different applications.

Technology: BIPOLAR

Bipolar technology provides stable and precise regulation, ensuring consistent output voltage regardless of fluctuations in input voltage.

Operating Temperature (TJ-Min): -40 °C

The low minimum operating temperature enables the regulator to function in cold environments without sacrificing performance.

Minimum Output Voltage-1: 1.2 V

With a low minimum output voltage, this regulator is suitable for applications that require a small output voltage.

Minimum Input-Output Voltage Differential: 3 V

The minimum voltage differential allows for efficient regulation while minimizing power loss, making the regulator energy-efficient.

Maximum Output Voltage-1: 37 V

The high maximum output voltage accommodates applications that require a large output voltage, increasing the regulator's compatibility with various systems.

Maximum Output Current-1: 0.5 A

With a maximum output current of 0.5 A, this regulator can deliver sufficient power for low-power devices, making it suitable for a wide range of electronic applications.

Technical Specifications

Adjustable Regulators - Positive Single Output Standard LM317MBDT-1 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output Standard devices from Onsemi

Specs

Maximum Input-Output Voltage Differential:

40 V

Minimum Input-Output Voltage Differential:

3 V

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

37 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Qualification Status:

Not Qualified

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

LM317MBDT-1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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