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LM293DMR2

Onsemi

LM293DMR2 by Onsemi

LM293DMR2 by Onsemi is a comparator with 9000uV max input offset voltage and 0.4uA max average bias current. It operates at -25 to 85 °C, has open-collector output, and requires 5V nominal supply. Ideal for applications requiring precise voltage comparison in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,351 parts In-Stock

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Digiode

USA . 1,266 parts In-Stock

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AZTECH Wire

Italy . 197 parts In-Stock

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$16.590

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RC Electronics

USA . 36,900 parts In-Stock

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Kepictronics

USA . 15,990 parts In-Stock

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SupplyDigital Components

Austria . 7,477 parts In-Stock

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Problanco Electronics

Mexico . 6,363 parts In-Stock

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Assy Fe

Spain . 3,216 parts In-Stock

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Kulean Microsystems

USA . 2,978 parts In-Stock

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TANS Electronics

Latvia . 2,637 parts In-Stock

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Corphita

USA . 1,887 parts In-Stock

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UHIMA Technologies

Türkiye . 490 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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Microchip USA

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Overview

Experience superior performance and reliability with the LM293DMR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality comparators that excel in a wide range of applications. Whether you're working on automotive systems, industrial controls, or consumer electronics, this product offers unmatched value, benefits, and advantages. With precise operation and a compact design, the LM293DMR2 ensures optimal functionality and efficiency in every project. Trust Onsemi for cutting-edge technology and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Maximum Input Offset Voltage: 9000 uV

The low input offset voltage ensures accurate and precise comparisons between input signals, resulting in reliable performance.

Maximum Average Bias Current (IIB): 0.4 uA

The low average bias current helps in minimizing power consumption and maintaining stable operation over extended periods.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into PCB designs, saving space and improving overall system efficiency.

No. of Functions: 2

Having multiple functions in a single component increases versatility and functionality, making it a cost-effective solution for different applications.

Maximum Supply Voltage Limit: 36 V

The high supply voltage limit provides flexibility in powering the device, accommodating a wide range of voltage inputs for varied use cases.

Technology: BIPOLAR

Bipolar technology ensures high-speed performance and precise signal processing, making it suitable for demanding applications that require quick response times.

Amplifier Type: COMPARATOR

As a comparator, this product is designed specifically for comparing two input signals and determining their relationship, making it ideal for applications requiring decision-making capabilities.

Technical Specifications

Comparators LM293DMR2 attributes and parameters. Explore more Comparators devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

2.5 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

235 °C (455 °F)

Nominal Response Time:

1.3 µs

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

LM293DMR2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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