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LM2575D2T-15R4G

Onsemi

LM2575D2T-15R4G by Onsemi

LM2575D2T-15R4G by Onsemi is a 3.3V BUCK switching regulator with 3.2A output current, operating b/w -40 to 125 °C. Ideal for automotive applications due to its small outline package and voltage-mode control technique at a max frequency of 63 kHz.

Median Price

$2.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

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$2.240

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1

$2.240

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Mouser Electronics

USA . 224 parts In-Stock

1+ parts

$2.780

100+ parts

$1.460

1k+ parts

$1.130

10k+ parts

$1.050

224

$2.780

$1.460

$1.130

$1.050

Distributors (In-Stock)

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Digiode

USA . 985 parts In-Stock

1+ parts

$2.641

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985

$2.641

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Chip Stock

USA . 50,000 parts In-Stock

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Vyrian

USA . 10,133 parts In-Stock

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Flip Electronics

USA . 800 parts In-Stock

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800

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Distributors (Availability)

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Corphita

USA . 758 parts In-Stock

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$2.502

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758

$2.502

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Corohmni

South Africa . 212 parts In-Stock

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$2.780

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212

$2.780

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Microchip USA

USA . 2,795 parts In-Stock

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$16.965

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$16.965

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SupplyDigital Components

Austria . 7,841 parts In-Stock

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Lixinc

USA . 7,731 parts In-Stock

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Problanco Electronics

Mexico . 3,329 parts In-Stock

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Kulean Microsystems

USA . 2,659 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 1,044 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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UHIMA Technologies

Türkiye . 186 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the LM2575D2T-15R4G switching regulator. Designed for a wide range of applications in automotive and industrial settings, this product offers customers high performance and efficiency. With its innovative technology and compact design, the LM2575D2T-15R4G delivers precise voltage control and maximum output current, ensuring optimal functionality. Trust Onsemi for top-notch products that meet all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making it a convenient choice for manufacturers.

Maximum Output Current: 3.2 A

With a high maximum output current, this switching regulator can handle demanding applications and power requirements with ease.

Nominal Input Voltage: 30 V

The wide nominal input voltage range allows for flexibility in different input power sources, making it suitable for a variety of setups.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation and stability, ensuring consistent performance in various operating conditions.

Technology: BIPOLAR

Bipolar technology provides reliability and efficiency, making this switching regulator a durable and long-lasting option for applications.

Technical Specifications

Switching Regulators & Controllers LM2575D2T-15R4G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.75 V

Nominal Input Voltage:

30 V

JESD-30 Code:

R-XSSO-G5

JESD-609 Code:

e3

Length:

10.02 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3.2 A

Nominal Output Voltage:

3.3 V

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

63 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.702 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9.1945 mm

Trade Compliance

LM2575D2T-15R4G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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