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LC01707PLF-TLM-H

Onsemi

LC01707PLF-TLM-H by Onsemi

LC01707PLF-TLM-H by Onsemi is a Silicon Tuner IC with 44 terminals, operating at -40 to 85°C. It features FM demodulation, 3.3V power supply, and 170mA max current draw. Ideal for industrial audio tuner applications due to its compact square package and CMOS technology.

Median Price

$4.690

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 501 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

501

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$4.070

$3.640

$3.420

DigiKey

USA . 501 parts In-Stock

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$4.690

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501

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$4.690

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Verical

USA . 501 parts In-Stock

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$5.063

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$4.525

10k+ parts

$4.263

501

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$5.063

$4.525

$4.263

Flip Electronics (Authorized)

USA . 188 parts In-Stock

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Digiode

USA . 648 parts In-Stock

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$4.284

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648

$4.284

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Vyrian

USA . 7,203 parts In-Stock

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Chip Stock

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Corphita

USA . 1,532 parts In-Stock

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$4.059

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1,532

$4.059

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Corohmni

South Africa . 103 parts In-Stock

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$4.510

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103

$4.510

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SupplyDigital Components

Austria . 7,648 parts In-Stock

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Problanco Electronics

Mexico . 5,992 parts In-Stock

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TANS Electronics

Latvia . 5,089 parts In-Stock

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Kulean Microsystems

USA . 3,399 parts In-Stock

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3,399

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 625 parts In-Stock

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Kepictronics

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Overview

Enhance your audio tuner applications with the high-quality LC01707PLF-TLM-H by Onsemi. Designed for optimal performance, this Silicon Tuner IC offers precise demodulation and a wide temperature range, perfect for industrial use. With a compact square package style and easy surface mount installation, this product provides convenience and efficiency. Trust in Onsemi's reputation for excellence in semiconductor manufacturing to deliver reliable and durable components. Upgrade your audio systems with the value and benefits of the LC01707PLF-TLM-H, ensuring top-notch performance and customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps to keep the overall weight of the product light and also provides good mechanical strength.

Surface Mount: YES

Being surface mountable makes it easy to integrate this silicon tuner IC into PCBs, reducing assembly time and enabling compact designs.

Power Supplies (V): 3.3

The low power supply voltage of 3.3V helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and compatibility with various systems and circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance even in demanding industrial environments.

Demodulation Type: FM

Supporting FM demodulation enables this IC to effectively process frequency-modulated signals for high-quality audio output.

Technology: CMOS

Utilizing CMOS technology offers advantages such as low power consumption, high noise immunity, and integrated functionality, enhancing overall performance.

Technical Specifications

Silicon Tuner ICs LC01707PLF-TLM-H attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

170 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

LC01707PLF-TLM-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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