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LA1193M

Onsemi

LA1193M by Onsemi

LA1193M by Onsemi is a Silicon Tuner IC with built-in IF amplifier, suitable for audio tuner applications. It features a small outline, low profile package style and operates in industrial temperature range (-40 to 85 °C). With surface mount capability and 20 terminals, it offers a compact design for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,762 parts In-Stock

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Digiode

USA . 357 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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Problanco Electronics

Mexico . 7,595 parts In-Stock

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Kulean Microsystems

USA . 6,570 parts In-Stock

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TANS Electronics

Latvia . 5,332 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 3,966 parts In-Stock

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Corphita

USA . 959 parts In-Stock

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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Corohmni

South Africa . 301 parts In-Stock

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Overview

Unlock a world of crystal-clear audio with the LA1193M Silicon Tuner IC by Onsemi, a top-tier manufacturer known for quality and innovation. Ideal for a wide range of applications, this small outline, low profile package offers built-in IF amplifier for enhanced performance. With a temperature grade suited for industrial use, this rectangular-shaped IC ensures reliable operation in extreme conditions. Elevate your audio experience with the LA1193M by Onsemi, delivering unmatched value, benefits, and advantages to customers seeking superior sound quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body helps in reducing weight and cost of the product.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier eliminates the need for an external amplifier, simplifying the design and reducing overall complexity.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort in production.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient use of space on the PCB, maximizing design flexibility.

General IC Type: AUDIO TUNER

Being an audio tuner IC, this product is specifically designed for audio applications, ensuring optimized performance in audio tuning tasks.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for various circuit configurations, allowing for versatile usage.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE

The small outline and low profile of the package style make it suitable for space-constrained applications and compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand elevated temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C makes this product suitable for use in cold environments without compromising performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in PCB layout design and ease of connection.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7 mm helps in maintaining a slim profile and compactness of the overall product.

Width: 5.4 mm

The narrow width of 5.4 mm enables efficient space utilization on the PCB, contributing to a compact design.

Minimum Supply Voltage (Vsup): 7.6 V

The low minimum supply voltage requirement of 7.6 V makes this product energy-efficient and suitable for battery-powered applications.

Length: 12.5 mm

The compact length of 12.5 mm allows for easy integration into small form factor devices without compromising functionality.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliability and stability in demanding industrial environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during PCB assembly, enhancing durability and manufacturability.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density packaging, enabling more functionality in a smaller footprint.

Maximum Supply Voltage (Vsup): 9 V

The maximum supply voltage of 9 V provides flexibility in power supply options while ensuring operational stability and performance.

Technical Specifications

Silicon Tuner ICs LA1193M attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

7.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.4 mm

Trade Compliance

LA1193M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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