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HCPL3700SDVM

Onsemi

HCPL3700SDVM by Onsemi

HCPL3700SDVM by Onsemi is a complex optocoupler with a max forward current of 0.05A and isolation voltage of 5000V. It operates b/w -40 to 85°C, making it suitable for logic IC output applications. This rectangular-shaped optocoupler has a surface mounting feature, ideal for various electronic circuits requiring high isolation levels.

Median Price

$2.590

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,480 parts In-Stock

1+ parts

$2.580

100+ parts

$1.439

1k+ parts

$1.192

10k+ parts

$1.066

1,480

$2.580

$1.439

$1.192

$1.066

Mouser Electronics

USA . 524 parts In-Stock

1+ parts

$2.600

100+ parts

$1.450

1k+ parts

$1.110

10k+ parts

-

524

$2.600

$1.450

$1.110

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Distributors (In-Stock)

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.770

10k+ parts

$1.590

2,000

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$1.770

$1.590

Digiode

USA . 1,778 parts In-Stock

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1,778

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Vyrian

USA . 274 parts In-Stock

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274

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Nova Conductors

Japan . 26 parts In-Stock

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26

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 272 parts In-Stock

1+ parts

$0.532

100+ parts

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272

$0.532

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Ampacity Inc.

Singapore . 307 parts In-Stock

1+ parts

$3.100

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307

$3.100

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SupplyDigital Components

Austria . 7,205 parts In-Stock

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7,205

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TANS Electronics

Latvia . 5,120 parts In-Stock

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Kulean Microsystems

USA . 3,863 parts In-Stock

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3,863

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Argo Parts USA

USA . 2,994 parts In-Stock

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Continental Prestige Electronics

USA . 2,241 parts In-Stock

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2,241

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Corphita

USA . 1,885 parts In-Stock

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1,885

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Problanco Electronics

Mexico . 1,493 parts In-Stock

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1,493

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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667

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Corohmni

South Africa . 390 parts In-Stock

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390

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Overview

Enhance the performance of your electronics with the HCPL3700SDVM optocoupler circuit outputs by Onsemi. Known for their high-quality manufacturing, Onsemi delivers reliable and efficient products that meet industry standards. Ideal for applications requiring complex configurations, this logic IC output optocoupler offers a maximum isolation voltage of 5000V and a minimum operating temperature of -40°C, ensuring durability and reliability in various environments. Upgrade your devices with the HCPL3700SDVM and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Configuration: COMPLEX

The complex configuration of this optocoupler circuit outputs allows for versatile applications and advanced circuit designs.

Maximum Forward Current: 0.05 A

With a high maximum forward current, this product is reliable and suitable for handling various loads.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler, this product ensures accurate signal transmission between different circuit components.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement makes this optocoupler energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Shape: RECTANGULAR

The rectangular shape of this optocoupler makes it easy to integrate into circuit designs and ensures a compact layout.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows this product to be used in extreme cold environments.

Packing Method: TR

The TR packing method ensures secure packaging for safe transportation and storage of the optocoupler.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage of 5000 V provides excellent protection against electrical interference and ensures signal integrity.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and saves space in PCB designs.

Maximum On State Current: 0.03 A

The low maximum on-state current helps in reducing power consumption and heat dissipation in the circuit.

Technical Specifications

Optocoupler Circuit Outputs HCPL3700SDVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

CMOS COMPATIBLE, TTL COMPATIBLE, IEC-60747-5-5, UL APPROVED

Configuration:

COMPLEX

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.03 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Shape:

RECTANGULAR

Minimum Supply Voltage:

2 V

Trade Compliance

HCPL3700SDVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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