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HCPL2630SVM

Onsemi

HCPL2630SVM by Onsemi

HCPL2630SVM by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It offers a max isolation voltage of 5000V, nominal data rate of 10MBps, and operates b/w -40 to 100°C. Ideal for applications requiring high-speed signal transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,587 parts In-Stock

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Vyrian

USA . 1,003 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Aztec Data Supply Inc.

USA . 4,666 parts In-Stock

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$0.035

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$0.035

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AZTECH Wire

Italy . 564 parts In-Stock

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$9.397

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Component Stockers USA

USA . 4,774 parts In-Stock

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$12.090

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$12.090

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Ampacity Inc.

Singapore . 933 parts In-Stock

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$18.100

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Kulean Microsystems

USA . 7,715 parts In-Stock

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TANS Electronics

Latvia . 4,302 parts In-Stock

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SupplyDigital Components

Austria . 3,139 parts In-Stock

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Corphita

USA . 2,386 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Supply Digital

USA . 1,100 parts In-Stock

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UHIMA Technologies

Türkiye . 910 parts In-Stock

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Argo Parts USA

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Corohmni

South Africa . 301 parts In-Stock

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Problanco Electronics

Mexico . 278 parts In-Stock

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Continental Prestige Electronics

USA . 251 parts In-Stock

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Overview

Enhance your electronic designs with the HCPL2630SVM by Onsemi, a high-quality optocoupler circuit output that offers a range of applications. Onsemi is renowned for its innovative technology and reliable products, making this optocoupler a top choice for engineers and hobbyists alike. With separate channels and a compact rectangular shape, this product provides seamless integration into various systems. Experience fast response times, high isolation voltage, and a nominal data rate of 10 MBps. Elevate your projects with the HCPL2630SVM and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having 2 separate channels allows for independent operation of two functions, providing flexibility and increased functionality.

Maximum Forward Current: 0.05 A

With a high maximum forward current, this optocoupler circuit output can handle heavy loads and ensure reliable performance.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler, this product is ideal for interfacing with digital systems and ensuring accurate signal transmission.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this optocoupler circuit output can withstand elevated temperatures without compromising performance.

Nominal Response Time: 40 ns

With a fast nominal response time of 40 nanoseconds, this product ensures quick signal transmission and minimal delay.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this optocoupler circuit output is suitable for a wide range of environments.

Maximum Isolation Voltage: 5000 V

With a high maximum isolation voltage, this product provides effective protection against voltage spikes and ensures safe operation in high-voltage applications.

Nominal Data Rate: 10 MBps

With a high nominal data rate of 10 megabits per second, this optocoupler circuit output supports fast data transmission and high-speed communication.

Mounting Feature: SURFACE MOUNT

The surface mounting feature makes installation quick and easy, saving time and effort during assembly.

Maximum On State Current: 0.025 A

With a low maximum on-state current, this optocoupler circuit output helps minimize power consumption and reduce heat generation.

Technical Specifications

Optocoupler Circuit Outputs HCPL2630SVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Nominal Data Rate:

10 MBps

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.025 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Response Time:

.0000001 s

Nominal Response Time:

40 ns

Shape:

RECTANGULAR

Minimum Supply Voltage:

4.5 V

Trade Compliance

HCPL2630SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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