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HCPL2630SDV

Onsemi

HCPL2630SDV by Onsemi

HCPL2630SDV by Onsemi is a 2-channel optocoupler with separate configuration. It has a max forward current of 0.03A and operates at temperatures from -40 to 85°C. Ideal for logic IC output applications, offering high isolation voltage of 2500V and fast response time of 75ns.

Median Price

$1.872

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

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$1.104

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$1.049

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$1.104

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DigiKey

USA . 16 parts In-Stock

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$2.640

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$2.640

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Digiode

USA . 978 parts In-Stock

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$1.049

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978

$1.049

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Nova Conductors

Japan . 900 parts In-Stock

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$1.337

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$1.337

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Vyrian

USA . 8,179 parts In-Stock

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Prism Electronics

USA . 969 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,979 parts In-Stock

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$0.490

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$0.490

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Ampacity Inc.

Singapore . 33 parts In-Stock

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$0.940

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33

$0.940

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Semicontronic

India . 33 parts In-Stock

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$0.940

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$0.916

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$0.912

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33

$0.940

$0.916

$0.912

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Corphita

USA . 2,668 parts In-Stock

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$0.994

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Corohmni

South Africa . 270 parts In-Stock

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$1.104

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$1.104

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$1.049

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$1.049

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Continental Prestige Electronics

USA . 3,747 parts In-Stock

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$1.270

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$1.245

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Argo Parts USA

USA . 3,381 parts In-Stock

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$1.270

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AZTECH Wire

Italy . 288 parts In-Stock

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$9.105

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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SupplyDigital Components

Austria . 7,411 parts In-Stock

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TANS Electronics

Latvia . 4,890 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

USA . 3,417 parts In-Stock

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Kulean Microsystems

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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UHIMA Technologies

Türkiye . 794 parts In-Stock

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Supply Digital

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Netroflash

USA . 500 parts In-Stock

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$1.310

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$1.243

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Problanco Electronics

Mexico . 463 parts In-Stock

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Robosynatics

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Lucentia Tech

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Overview

Enhance your electronic projects with the HCPL2630SDV by Onsemi, a high-quality optocoupler circuit output with separate 2 channels. Manufactured by industry leader Onsemi, this product offers unbeatable reliability and performance. Ideal for applications requiring precise signal isolation, this optocoupler provides seamless integration and exceptional response time. Experience the value of superior quality and precision engineering with the HCPL2630SDV, designed to elevate your projects to new heights.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having two separate channels allows for independent control and isolation of two different signals, making it versatile for various applications.

No. of Functions: 2

With two functions in one device, it offers cost-effectiveness and space-saving benefits for circuit designs.

Maximum Forward Current: 0.03 A

The high maximum forward current rating ensures the optocoupler can handle heavy loads without overheating, increasing reliability.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler enables easy interfacing between different logic levels, making it ideal for digital circuits.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows for operation in low power applications or battery-powered devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the optocoupler can perform reliably in harsh environments without compromising performance.

Nominal Response Time: 75 ns

The fast response time ensures quick signal transmission, making it suitable for time-critical applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without risking damage to the optocoupler.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and excellent solderability, ensuring a reliable electrical connection.

Maximum Power Dissipation: 0.06 W

With low power dissipation, the optocoupler operates efficiently and helps in reducing overall energy consumption.

No. of Elements: 2

Having two elements in one package simplifies circuit designs and reduces component count, saving on board space and cost.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many circuits, making integration with existing designs seamless.

Maximum Isolation Voltage: 2500 V

The high isolation voltage rating ensures safe operation in high voltage applications, protecting sensitive circuitry.

Nominal Data Rate: 10 MBps

The high data rate capability makes the optocoupler suitable for high-speed communication systems.

Mounting Feature: SURFACE MOUNT

The surface mount package offers easy installation and space-saving benefits in compact electronic devices.

Maximum On State Current: 0.05 A

The high maximum on-state current rating allows the optocoupler to handle heavy loads with ease, ensuring reliable operation.

Technical Specifications

Optocoupler Circuit Outputs HCPL2630SDV attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

CMOS COMPATIBLE, OPEN COLLECTOR, UL RECOGNIZED, VDE APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Nominal Data Rate:

10 MBps

Maximum Forward Current:

.03 A

Maximum Isolation Voltage:

2500 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.05 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.06 W

Nominal Response Time:

75 ns

Sub-Category:

Optocoupler - IC Outputs

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Terminal Finish:

Trade Compliance

HCPL2630SDV Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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