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HCPL2611SM

Onsemi

HCPL2611SM by Onsemi

HCPL2611SM by Onsemi is a single optocoupler with a max forward current of 0.05A and an isolation voltage of 5000V, suitable for logic IC output applications. It has a nominal response time of 40ns, operates b/w -40 to 100 °C, and offers a data rate of 10MBps. Ideal for surface mounting with matte tin finish in tube packaging.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,728 parts In-Stock

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Vyrian

USA . 194 parts In-Stock

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Ampacity Inc.

Singapore . 1,435 parts In-Stock

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$3.100

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Native Components

USA . 307 parts In-Stock

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$7.235

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Kulean Microsystems

USA . 8,162 parts In-Stock

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TANS Electronics

Latvia . 7,705 parts In-Stock

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Problanco Electronics

Mexico . 7,419 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,274 parts In-Stock

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SupplyDigital Components

Austria . 4,249 parts In-Stock

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Supply Digital

USA . 1,717 parts In-Stock

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Northwest PG Solutions

USA . 1,258 parts In-Stock

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$7.090

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Corphita

USA . 1,141 parts In-Stock

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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Overview

Enhance your electronic designs with the HCPL2611SM by Onsemi! This high-quality optocoupler circuit output offers a single configuration and logic IC output for seamless integration. With a maximum isolation voltage of 5000V and a nominal data rate of 10 MBps, this product ensures reliable performance and precision. Perfect for applications requiring secure signal transmission, the HCPL2611SM provides exceptional value and benefits to customers seeking top-notch quality and efficiency in their projects. Upgrade your designs today with Onsemi's trusted technology!

Feature Benefit Bullets

Configuration: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design.

Maximum Forward Current: 0.05 A

Capable of handling a maximum forward current of 0.05 A, ensuring reliable performance in various applications.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Utilizes logic IC output optocoupler technology for efficient signal transmission and isolation.

Minimum Supply Voltage: 4.5 V

Operates efficiently at a minimum supply voltage of 4.5 V, suitable for low voltage applications.

Maximum Operating Temperature: 100 °C

Withstands temperatures up to 100 °C, ensuring reliable operation in high-temperature environments.

Shape: RECTANGULAR

Rectangular shape for easy integration and space-saving design in circuits.

Nominal Response Time: 40 ns

Fast nominal response time of 40 nanoseconds for quick signal transmission and response.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures down to -40 °C, suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish for corrosion resistance and reliable electrical connections.

Packing Method: TUBE

Packaged in a tube for easy handling and storage, protecting the product during shipping and installation.

Maximum Response Time: 0.0000001 s

Extremely fast maximum response time of 0.0000001 seconds for near-instantaneous signal transmission.

Maximum Isolation Voltage: 5000 V

Provides high isolation voltage of 5000 V for safety and protection against voltage spikes.

Nominal Data Rate: 10 MBps

Offers a high nominal data rate of 10 MBps for fast and efficient data transmission.

Mounting Feature: SURFACE MOUNT

Surface mounting feature for easy installation on PCBs, saving space and simplifying assembly.

Maximum On State Current: 0.025 A

Handles a maximum on state current of 0.025 A, ensuring safe operation and protection against overcurrent.

Technical Specifications

Optocoupler Circuit Outputs HCPL2611SM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Nominal Data Rate:

10 MBps

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.025 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Response Time:

.0000001 s

Nominal Response Time:

40 ns

Shape:

RECTANGULAR

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

HCPL2611SM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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