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HCPL2531TVM

Onsemi

HCPL2531TVM by Onsemi

HCPL2531TVM by Onsemi is a 2-channel optocoupler with max. forward current of 0.025A and isolation voltage of 5000V. Ideal for logic IC output applications, it operates b/w 0-70°C, has a data rate of 1MBps, and features matte tin terminal finish.

Median Price

$1.600

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 999 parts In-Stock

1+ parts

$1.106

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999

$1.106

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Chip1Stop

Japan . 999 parts In-Stock

1+ parts

$1.690

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999

$1.690

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Rochester

USA . 2,000 parts In-Stock

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-

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$1.510

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$1.250

10k+ parts

$1.120

2,000

-

$1.510

$1.250

$1.120

DigiKey

USA . 2,000 parts In-Stock

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$1.890

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2,000

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$1.890

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Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

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2,000

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Verical

USA . 999 parts In-Stock

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Digiode

USA . 1,846 parts In-Stock

1+ parts

$1.039

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1,846

$1.039

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Nova Conductors

Japan . 55 parts In-Stock

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$1.294

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55

$1.294

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Flip Electronics

USA . 2,000 parts In-Stock

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DigiKey Marketplace

USA . 2,000 parts In-Stock

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Vyrian

USA . 1,234 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,217 parts In-Stock

1+ parts

$0.563

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2,217

$0.563

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Semicontronic

India . 1,244 parts In-Stock

1+ parts

$0.930

100+ parts

$0.907

1k+ parts

$0.902

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1,244

$0.930

$0.907

$0.902

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Ampacity Inc.

Singapore . 1,210 parts In-Stock

1+ parts

$0.930

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1,210

$0.930

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Corphita

USA . 1,166 parts In-Stock

1+ parts

$0.985

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$0.985

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Corohmni

South Africa . 174 parts In-Stock

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$1.094

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174

$1.094

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Argo Parts USA

USA . 377 parts In-Stock

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$1.294

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377

$1.294

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Continental Prestige Electronics

USA . 65 parts In-Stock

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$1.294

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$1.268

65

$1.294

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$1.268

Bastille Electronics

Australia . 4,897 parts In-Stock

1+ parts

$1.294

100+ parts

$1.229

1k+ parts

$1.168

10k+ parts

$1.152

4,897

$1.294

$1.229

$1.168

$1.152

QUARKTWIN TECHNOLOGY LTD

USA . 21,815 parts In-Stock

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21,815

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SupplyDigital Components

Austria . 6,664 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 3,864 parts In-Stock

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TANS Electronics

Latvia . 1,620 parts In-Stock

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Kulean Microsystems

USA . 1,566 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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850

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Supply Digital

USA . 840 parts In-Stock

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840

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Overview

Discover the reliability and performance of the HCPL2531TVM by Onsemi, a top-tier manufacturer in the industry. This optocoupler circuit output offers unparalleled quality and precision with its 2 channels, separate configuration, and impressive data rate of 1 MBps. Ideal for a variety of applications, this product provides customers with unmatched value, benefits, and advantages. Trust Onsemi to deliver innovative solutions that exceed expectations. Elevate your projects with the HCPL2531TVM today.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for independent control of each function, providing versatility in usage scenarios.

Maximum Forward Current: 0.025 A

The high maximum forward current capability ensures that the optocoupler can handle significant loads without overheating or failing.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

This type of optocoupler is specifically designed for interfacing with logic IC outputs, ensuring reliable communication between devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement makes this optocoupler suitable for use in a wide range of electronic systems, including those with limited power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for the optocoupler to be used in industrial environments where temperatures can fluctuate.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the optocoupler can function reliably even in cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good electrical conductivity and corrosion resistance, ensuring stable connections over time.

No. of Elements: 2

Having two elements allows for dual-channel functionality, enhancing the versatility and capabilities of the optocoupler.

Packing Method: TUBE

The tube packing method provides ease of handling and storage, protecting the optocoupler during transportation and handling.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage ensures safe operation in high-voltage applications, preventing electrical interference between circuits.

Nominal Data Rate: 1 MBps

The high nominal data rate allows for fast and reliable communication between devices, making this optocoupler suitable for high-speed applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides secure and stable attachment to circuit boards, ensuring mechanical stability during operation.

Maximum On State Current: 0.008 A

The low maximum on-state current ensures efficient power consumption and minimizes heat generation, making this optocoupler energy-efficient.

Technical Specifications

Optocoupler Circuit Outputs HCPL2531TVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, TTL AND CMOS COMPATIBLE, UL APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Nominal Data Rate:

1 MBps

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.008 A

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

HCPL2531TVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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