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FAN6390MPXMPX

Onsemi

FAN6390MPXMPX by Onsemi

FAN6390MPXMPX by Onsemi is a Power Management IC with 24 terminals, operating at -40 to 125 °C. It has a supply voltage of 5V, supports up to 3 channels, and features an adjustable threshold. Ideal for automotive applications due to its compact square package shape and low seated height of 0.8mm.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,852 parts In-Stock

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Vyrian

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Native Components

USA . 998 parts In-Stock

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$13.055

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Northwest PG Solutions

USA . 1,465 parts In-Stock

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$12.924

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Problanco Electronics

Mexico . 7,734 parts In-Stock

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SupplyDigital Components

Austria . 7,708 parts In-Stock

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Kulean Microsystems

USA . 7,066 parts In-Stock

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TANS Electronics

Latvia . 1,509 parts In-Stock

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Corphita

USA . 1,039 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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UHIMA Technologies

Türkiye . 274 parts In-Stock

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Overview

Enhance your power management solutions with the FAN6390MPXMPX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that guarantee reliability and efficiency. With surface mount capability and a wide range of applications, this product is a must-have for automotive systems. Experience the benefits of its adjustable threshold and multiple channels, offering customers unparalleled value and performance. Trust Onsemi to provide cutting-edge technology that meets all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily and securely mounted on a PCB, making it suitable for mass production and automation.

Nominal Supply Voltage (Vsup): 5 V

Works with a common supply voltage, making it compatible with a wide range of applications.

No. of Terminals: 24

Provides multiple connection points for different components, offering flexibility in circuit design.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments, making it suitable for outdoor and cold storage applications.

No. of Channels: 3

Has multiple channels for different power management tasks, allowing for more versatile usage.

Adjustable Threshold: YES

The threshold voltage can be adjusted, allowing for customization and optimization of power management settings.

Technical Specifications

Power Management ICs FAN6390MPXMPX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

20 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.2V

Width (mm):

4 mm

Trade Compliance

FAN6390MPXMPX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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