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FAN5646S700X

Onsemi

FAN5646S700X by Onsemi

FAN5646S700X by Onsemi is a small outline, thin profile IC with 5 terminals. It operates b/w -40 to 85 °C and supports supply voltage from 2.7V to 5.5V. Ideal for consumer circuits, this IC is surface mountable and has a peak reflow temperature of 260°C.

Median Price

$16.448

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55,626 parts In-Stock

1+ parts

-

100+ parts

$14.620

1k+ parts

$13.080

10k+ parts

$12.310

55,626

-

$14.620

$13.080

$12.310

Verical

USA . 52,626 parts In-Stock

1+ parts

-

100+ parts

$18.275

1k+ parts

$16.350

10k+ parts

$15.387

52,626

-

$18.275

$16.350

$15.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,569 parts In-Stock

1+ parts

$15.466

100+ parts

-

1k+ parts

-

10k+ parts

-

1,569

$15.466

-

-

-

Vyrian

USA . 1,303 parts In-Stock

1+ parts

$16.280

100+ parts

-

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-

10k+ parts

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1,303

$16.280

-

-

-

DigiKey Marketplace

USA . 55,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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55,626

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-

-

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ACDS - Activité Composants Distribution Service

France . 24,000 parts In-Stock

1+ parts

-

100+ parts

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24,000

-

-

-

-

Prism Electronics

USA . 2,785 parts In-Stock

1+ parts

-

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2,785

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,154 parts In-Stock

1+ parts

$14.652

100+ parts

-

1k+ parts

-

10k+ parts

-

1,154

$14.652

-

-

-

Corohmni

South Africa . 408 parts In-Stock

1+ parts

$16.280

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$16.280

-

-

-

Native Components

USA . 910 parts In-Stock

1+ parts

$63.560

100+ parts

-

1k+ parts

-

10k+ parts

$61.018

910

$63.560

-

-

$61.018

Northwest PG Solutions

USA . 2,087 parts In-Stock

1+ parts

$69.916

100+ parts

-

1k+ parts

-

10k+ parts

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2,087

$69.916

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-

-

Perfect Parts

USA . 62,630 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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62,630

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-

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

1+ parts

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30,000

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-

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Cyclops Electronics Ltd (Excess)

UK . 24,000 parts In-Stock

1+ parts

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100+ parts

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24,000

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 21,580 parts In-Stock

1+ parts

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21,580

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SupplyDigital Components

Austria . 6,259 parts In-Stock

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6,259

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-

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Microchip USA

USA . 5,936 parts In-Stock

1+ parts

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5,936

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TANS Electronics

Latvia . 4,347 parts In-Stock

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4,347

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-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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-

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Supply Digital

USA . 2,391 parts In-Stock

1+ parts

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2,391

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Kulean Microsystems

USA . 2,020 parts In-Stock

1+ parts

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2,020

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Problanco Electronics

Mexico . 1,052 parts In-Stock

1+ parts

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1,052

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UHIMA Technologies

Türkiye . 543 parts In-Stock

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543

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Kepictronics

USA . 300 parts In-Stock

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300

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Overview

Elevate your consumer electronics with the FAN5646S700X by Onsemi. This small outline, thin profile IC delivers top-notch performance and reliability for a wide range of applications. With Onsemi's reputation for quality and innovation, you can trust that this product will exceed your expectations. From its dual terminal position to its industrial temperature grade, the FAN5646S700X offers unmatched value and benefits to enhance your projects. Upgrade your designs today with this exceptional consumer circuit IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape offers a compact and space-saving design, ideal for applications with limited board space.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this IC can withstand harsh conditions and maintain reliable performance.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement allows for efficient power usage and compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs FAN5646S700X attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

FAN5646S700X General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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