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FAN1080M6X

Onsemi

FAN1080M6X by Onsemi

FAN1080M6X by Onsemi is a voltage-mode switching controller with a max operating temperature of 125 °C. It features a buck-boost switcher configuration and operates at a max switching frequency of 83 kHz. Ideal for automotive applications due to its small outline, low profile package style and matte tin terminal finish.

Median Price

$0.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip1Stop

Japan . 150 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Vyrian

USA . 11,756 parts In-Stock

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Digiode

USA . 279 parts In-Stock

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Native Components

USA . 654 parts In-Stock

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AZTECH Wire

Italy . 130 parts In-Stock

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Perfect Parts

USA . 15,624 parts In-Stock

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SupplyDigital Components

Austria . 8,175 parts In-Stock

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TANS Electronics

Latvia . 7,430 parts In-Stock

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Problanco Electronics

Mexico . 4,366 parts In-Stock

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Kulean Microsystems

USA . 2,754 parts In-Stock

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Authorized Procurement Solutions

USA . 2,750 parts In-Stock

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GreenTree Electronics

Israel . 2,750 parts In-Stock

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Northwest PG Solutions

USA . 2,049 parts In-Stock

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Corphita

USA . 1,454 parts In-Stock

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UHIMA Technologies

Türkiye . 980 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Experience superior performance and reliability with the FAN1080M6X from Onsemi, a leading manufacturer in the industry. This switching regulator offers unparalleled efficiency and precision in regulating voltage, making it ideal for various applications. With a compact design and advanced technology, this product ensures optimal performance even in the most demanding conditions. Trust Onsemi to deliver top-quality products that exceed expectations and provide unmatched value to customers. Elevate your electronics with the FAN1080M6X and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the internal components, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 12 V

Suitable for a wide range of applications requiring a 12V power source.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, making it suitable for industrial and automotive applications.

Control Mode: VOLTAGE-MODE

Offers precise control over output voltage, ensuring stable and efficient performance.

Technology: MOS

Utilizes MOSFET technology for high efficiency and fast switching performance.

Technical Specifications

Switching Regulators & Controllers FAN1080M6X attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

RESONANT CONTROL

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

83 kHz

Technology:

MOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.55 mm

Trade Compliance

FAN1080M6X Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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