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ESD5384

Onsemi

ESD5384 by Onsemi

ESD5384 by Onsemi is a consumer IC with 9 terminals in a square package. It operates b/w -30 °C to 85°C, with supply voltage ranging from 6V to 20V. Its grid array style makes it suitable for various consumer circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,603 parts In-Stock

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Digiode

USA . 856 parts In-Stock

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856

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Kulean Microsystems

USA . 7,003 parts In-Stock

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SupplyDigital Components

Austria . 6,868 parts In-Stock

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Problanco Electronics

Mexico . 3,082 parts In-Stock

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Corphita

USA . 932 parts In-Stock

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Northwest PG Solutions

USA . 182 parts In-Stock

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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Native Components

USA . 148 parts In-Stock

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Corohmni

South Africa . 104 parts In-Stock

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TANS Electronics

Latvia . 57 parts In-Stock

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Overview

Enhance your consumer electronic designs with the high-quality ESD5384 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-of-the-line products that guarantee reliability and performance. This versatile IC is perfect for a wide range of applications, offering customers value and benefits that exceed expectations. With its advanced features and exceptional design, the ESD5384 is the ideal choice for your next project. Experience the advantages of Onsemi's expertise and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring the longevity of the product.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Facilitates a compact design that can fit well in various electronic devices.

General IC Type: CONSUMER CIRCUIT

Tailored for consumer electronics applications, making it suitable for a wide range of everyday devices.

No. of Terminals: 9

Provides sufficient connection points for various inputs and outputs, enhancing the functionality of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density mounting and reduces the overall footprint of the product, ideal for compact devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high-temperature conditions, increasing the product's versatility.

Minimum Operating Temperature: -30 °C

Allows the product to withstand cold environments without compromising its functionality.

Terminal Position: BOTTOM

Facilitates easy connection to circuit boards and other components, enhancing the product's usability.

Maximum Seated Height: 0.63 mm

Contributes to a slim and compact design, ideal for applications where space is limited.

Width: 1.14 mm

Compact width allows for easy integration into various electronic devices without taking up too much space.

Minimum Supply Voltage (Vsup): 6 V

Allows for a wide range of power supply options, making the product versatile and adaptable to different scenarios.

Length: 1.14 mm

Compact length helps in fitting the product in constrained spaces without compromising on performance.

Terminal Form: BALL

Enhances connection reliability and durability, ensuring stable performance over time.

Terminal Pitch: 0.4 mm

Enables high-density mounting and precise connections, improving the overall efficiency and performance of the product.

Maximum Supply Voltage (Vsup): 20 V

Provides flexibility in power supply options, accommodating a wide range of voltage inputs for different applications.

Technical Specifications

Other Function Consumer ICs ESD5384 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B9

Length:

1.14 mm

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.63 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.14 mm

Trade Compliance

ESD5384 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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