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DG12100C

Onsemi

DG12100C by Onsemi

The Onsemi DG12100C is a 120x104 pixel display with dimensions of 98x72x12 mm. It operates b/w 0-40 °C, making it suitable for various applications requiring a compact and high-resolution display such as portable devices and IoT gadgets.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 907 parts In-Stock

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Digiode

USA . 804 parts In-Stock

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Distributors (Availability)

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TANS Electronics

Latvia . 6,245 parts In-Stock

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Kulean Microsystems

USA . 5,231 parts In-Stock

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Problanco Electronics

Mexico . 4,829 parts In-Stock

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SupplyDigital Components

Austria . 2,010 parts In-Stock

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Northwest PG Solutions

USA . 1,669 parts In-Stock

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UHIMA Technologies

Türkiye . 883 parts In-Stock

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883

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Native Components

USA . 544 parts In-Stock

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Corphita

USA . 359 parts In-Stock

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Corohmni

South Africa . 267 parts In-Stock

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Overview

Enhance your visual experience with the DG12100C by Onsemi. Known for their top-notch quality and reliability, Onsemi's displays and monitors are a cut above the rest. With a sleek design and impressive pixel count, this product delivers crisp images and vibrant colors. Whether you're using it for gaming, graphic design, or simply watching movies, the DG12100C offers unmatched value and performance. Upgrade your display today and see the difference for yourself!

Feature Benefit Bullets

Horizontal Pixel Count: 120 Pixel

High pixel count allows for crisp and detailed images on the display, providing a high-quality viewing experience.

Depth: 12 mm

Slim design makes this product sleek and space-saving, ideal for modern setups where space is a premium.

Maximum Operating Temperature: 40 °C

Wide operating temperature range ensures that the display can function effectively in various environments without overheating.

Height: 72 mm

Compact height makes this product suitable for smaller workspaces where vertical space is limited.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable performance even in colder conditions, making it versatile for different climates.

Viewing Area Length: 59 mm

Optimal viewing area length ensures that users can comfortably view content on the display without straining their eyes.

Length: 98 mm

Moderate length provides a good balance between screen size and space efficiency, making it suitable for various applications.

Viewing Area Height: 46 mm

Good viewing area height offers ample space for displaying content, enhancing the user experience.

Pixel Count (Vertical): 104 Pixel

High vertical pixel count contributes to the overall sharpness and clarity of images displayed on the monitor, ensuring a visually appealing experience.

Technical Specifications

Displays & Monitors DG12100C attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Horizontal Pixel Count:

120 Pixel

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Depth:

12 mm

Height:

72 mm

Length:

98 mm

Sub-Category:

Displays

Pixel Count (Vertical):

104 Pixel

Viewing Area Height:

46 mm

Viewing Area Length:

59 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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