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CS8351XDW16

Onsemi

CS8351XDW16 by Onsemi

CS8351XDW16 by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.6V Max Dropout Voltage, and 0.05A Max Output Current. It is ideal for applications requiring stable voltage regulation in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,208 parts In-Stock

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2,208

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Digiode

USA . 1,476 parts In-Stock

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1,476

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 982 parts In-Stock

1+ parts

$13.686

100+ parts

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982

$13.686

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Northwest PG Solutions

USA . 1,500 parts In-Stock

1+ parts

$15.054

100+ parts

$13.549

1k+ parts

-

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1,500

$15.054

$13.549

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Kulean Microsystems

USA . 6,341 parts In-Stock

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6,341

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SupplyDigital Components

Austria . 2,954 parts In-Stock

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2,954

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TANS Electronics

Latvia . 1,579 parts In-Stock

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1,579

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Problanco Electronics

Mexico . 451 parts In-Stock

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451

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Corohmni

South Africa . 446 parts In-Stock

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446

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Corphita

USA . 246 parts In-Stock

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UHIMA Technologies

Türkiye . 222 parts In-Stock

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222

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Overview

Elevate your electronic designs with the CS8351XDW16 by Onsemi, a high-quality Fixed Regulator with Positive Single Output LDO technology. Manufactured by industry leader Onsemi, this versatile regulator offers reliable performance and precise voltage control for a wide range of applications. With its compact package design and superior thermal management, the CS8351XDW16 delivers unmatched value and efficiency, making it the ideal choice for demanding projects where stability and accuracy are essential. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the regulator.

Maximum Dropout Voltage: 1.6 V

Allows for stable output voltage even when the input voltage fluctuates, making the regulator reliable in varying conditions.

Surface Mount: YES

Enables easy and efficient installation on PCBs, saving time and effort in the assembly process.

Operating Temperature (TJ-Max): 150 °C

Offers high temperature tolerance, making the regulator suitable for applications where heat dissipation is a concern.

Package Shape: RECTANGULAR

Facilitates compact and space-saving designs for electronic devices where size constraints are a consideration.

Terminal Form: GULL WING

Allows for secure and stable connections on the PCB, minimizing the risk of loose connections or disconnections.

Minimum Output Voltage: 4.8 V

Provides a stable and regulated output voltage, ensuring consistent performance of the connected electronic components.

Maximum Voltage Tolerance: 4 %

Ensures accurate output voltage regulation, preventing damage to sensitive electronic components due to overvoltage.

Nominal Output Voltage: 5 V

Common and widely accepted output voltage level, suitable for a variety of electronic applications.

No. of Terminals: 16

Allows for multiple connection points, enabling versatility in the application and integration of the regulator.

Package Style (Meter): SMALL OUTLINE

Offers a compact and lightweight package, ideal for space-constrained electronic designs.

Terminal Pitch: 1.27 mm

Enables easy installation on standard PCB layouts, ensuring compatibility with existing hardware.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Provides stable and precise voltage regulation, ensuring reliable performance of electronic devices.

Terminal Finish: TIN LEAD

Facilitates soldering and secure connections, ensuring long-term reliability in electronic circuits.

Terminal Position: DUAL

Allows for flexibility in PCB layout and connection options, accommodating different design requirements.

Maximum Output Voltage: 5.2 V

Offers a slightly higher voltage option, suitable for applications requiring a slightly higher output level.

Maximum Seated Height: 2.65 mm

Ensures a low profile design, ideal for slim and compact electronic devices.

Width: 7.5 mm

Compact width dimension, suitable for space-constrained applications and compact electronic designs.

Minimum Input Voltage: 7 V

Allows for operation with lower input voltage levels, providing flexibility in power supply options.

Maximum Output Current: 0.05 A

Capable of delivering low to moderate output current levels, suitable for a wide range of electronic applications.

Length: 10.3 mm

Compact length dimension, ideal for space-constrained electronic designs and compact PCB layouts.

Maximum Input Voltage: 26 V

Capable of handling a wide range of input voltage levels, providing flexibility in power supply options.

Technical Specifications

Fixed Regulators - Positive Single Output LDO CS8351XDW16 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.6 V

Maximum Input Voltage:

26 V

Minimum Input Voltage:

7 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.05 A

Maximum Output Voltage-1:

5.2 V

Minimum Output Voltage-1:

4.8 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification Status:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

4 %

Width:

7.5 mm

Trade Compliance

CS8351XDW16 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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