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CS5422DWFR24

Onsemi

CS5422DWFR24 by Onsemi

CS5422DWFR24 by Onsemi is a 2-function switching controller with max output current of 1.5A and max switching frequency of 750kHz. Ideal for applications requiring pulse width modulation control technique, such as small outline voltage regulators in commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,763 parts In-Stock

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1,763

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Vyrian

USA . 1,076 parts In-Stock

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1,076

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Distributors (Availability)

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Native Components

USA . 941 parts In-Stock

1+ parts

$10.763

100+ parts

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941

$10.763

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Northwest PG Solutions

USA . 763 parts In-Stock

1+ parts

$11.839

100+ parts

$10.655

1k+ parts

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763

$11.839

$10.655

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SupplyDigital Components

Austria . 7,750 parts In-Stock

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7,750

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Kulean Microsystems

USA . 7,061 parts In-Stock

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7,061

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Problanco Electronics

Mexico . 4,046 parts In-Stock

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4,046

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Corphita

USA . 1,008 parts In-Stock

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1,008

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UHIMA Technologies

Türkiye . 875 parts In-Stock

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875

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Corohmni

South Africa . 169 parts In-Stock

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169

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TANS Electronics

Latvia . 159 parts In-Stock

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159

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Overview

Enhance your electronic designs with the CS5422DWFR24 by Onsemi, a top-tier manufacturer known for quality and reliability. As a versatile switching regulator & controller, this product offers seamless current/voltage-mode control in a compact package, making it ideal for a wide range of applications. Experience the value of its advanced features like pulse width modulation and push-pull switcher configuration, providing maximum output current of 1.5 A. Elevate your projects with Onsemi's cutting-edge technology and elevate your results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, reducing the overall weight of the product.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

With two functions in one device, this product offers cost and space efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and alignment on the circuit board.

No. of Terminals: 24

The high number of terminals provides additional connectivity options, allowing for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliable performance even in harsh environmental conditions.

Control Mode: CURRENT/VOLTAGE-MODE

The current/voltage-mode control offers flexibility in regulating power output based on specific application requirements.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in a wide range of ambient temperatures.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and conductivity for reliable connection to the circuit.

Terminal Position: DUAL

The dual terminal position allows for easy and secure soldering onto the circuit board, ensuring stable connections.

Maximum Seated Height: 2.65 mm

The low seated height of the package helps in maintaining a slim profile for the overall circuit layout.

Width (mm): 7.5 mm

The compact width of 7.5 mm allows for space-saving integration in small electronic devices.

Other IC type: SWITCHING CONTROLLER

The switching controller IC type offers efficient power management and regulation for improved performance.

Nominal Input Voltage: 12 V

The 12V nominal input voltage is a commonly used standard, making this product compatible with many power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum reflow time ensures proper soldering of the product during assembly.

Peak Reflow Temperature °C: 225

The high peak reflow temperature of 225 °C ensures reliable solder joints for robust circuit connections.

Length: 15.395 mm

The length of 15.395 mm provides a compact form factor, suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating ensures reliable operation in standard environmental conditions.

Maximum Switching Frequency: 750 kHz

The high switching frequency of 750 kHz allows for efficient power conversion and regulation.

Maximum Output Current: 1.5 A

With a maximum output current of 1.5 A, this product can deliver sufficient power for a variety of applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder connections on the circuit board.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique offers precise regulation of power output for optimal performance.

Switcher Config: PUSH-PULL

The push-pull switcher configuration enhances efficiency and reduces electromagnetic interference in the circuit.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy mounting and soldering, facilitating quick and secure connections.

Minimum Input Voltage: 10.8 V

The 10.8V minimum input voltage ensures the product can operate efficiently even with low voltage power sources.

Maximum Input Voltage: 13.2 V

The 13.2V maximum input voltage provides a safe operating range for the product, protecting it from voltage spikes.

Technical Specifications

Switching Regulators & Controllers CS5422DWFR24 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.2 V

Minimum Input Voltage:

10.8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.395 mm

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

225

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

750 kHz

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

CS5422DWFR24 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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