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BZX84C3V9ET1

Onsemi

BZX84C3V9ET1 by Onsemi

BZX84C3V9ET1 by Onsemi is a Zener diode with a nominal reference voltage of 3.9V and max power dissipation of 0.25W. It operates in temperatures ranging from -65 to 150 °C, with a max voltage tolerance of 5.13%. This diode is ideal for applications requiring precise voltage regulation in compact electronic devices due to its small outline package style and unidirectional polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,664 parts In-Stock

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Digiode

USA . 946 parts In-Stock

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AZTECH Wire

Italy . 352 parts In-Stock

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$17.500

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Component Stockers USA

USA . 722 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 3,386 parts In-Stock

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Problanco Electronics

Mexico . 3,051 parts In-Stock

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SupplyDigital Components

Austria . 1,042 parts In-Stock

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UHIMA Technologies

Türkiye . 917 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 375 parts In-Stock

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Northwest PG Solutions

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Corohmni

South Africa . 141 parts In-Stock

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Overview

Discover the superior quality and reliability of the BZX84C3V9ET1 Zener Diode by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch products that exceed customer expectations. Ideal for a variety of applications, this Zener diode offers unmatched performance and efficiency. Experience the value and benefits of choosing Onsemi for all your electronic component needs. Trust in the quality and innovation that Onsemi brings to the table with the BZX84C3V9ET1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the diode, making it suitable for various applications.

Working Test Current: 5 mA

Low working test current helps in efficient power management and reduces energy consumption.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy installation and PCB layout.

Maximum Voltage Tolerance: 5.13 %

High voltage tolerance ensures stable performance and reliability in fluctuating voltage conditions.

Nominal Reference Voltage: 3.9 V

Stable nominal reference voltage of 3.9V provides precise control and regulation in electronic circuits.

Maximum Power Dissipation: 0.25 W

Low power dissipation of 0.25W helps in reducing heat generation and increasing efficiency.

Diode Type: ZENER DIODE

Zener diode type ensures accurate voltage regulation and protection against voltage spikes.

Technical Specifications

Zener Diodes BZX84C3V9ET1 attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

90 ohm

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Maximum Knee Impedance:

600 ohm

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Nominal Reference Voltage:

3.9 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5.13 %

Working Test Current:

5 mA

Trade Compliance

BZX84C3V9ET1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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