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AR0331SRSC00XUEAH-GEVB

Onsemi

AR0331SRSC00XUEAH-GEVB by Onsemi

AR0331SRSC00XUEAH-GEVB by Onsemi is an Image Sensor Evaluation Board. It features the AR0331SR IC, MSL level 1, and comes in bulk packaging. Ideal for testing image sensor performance in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,670 parts In-Stock

1+ parts

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6,670

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Digiode

USA . 1,317 parts In-Stock

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1,317

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Distributors (Availability)

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AZTECH Wire

Italy . 140 parts In-Stock

1+ parts

$19.260

100+ parts

-

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140

$19.260

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Native Components

USA . 384 parts In-Stock

1+ parts

$144.539

100+ parts

-

1k+ parts

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10k+ parts

$138.757

384

$144.539

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$138.757

Northwest PG Solutions

USA . 7 parts In-Stock

1+ parts

$158.992

100+ parts

-

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7

$158.992

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Kulean Microsystems

USA . 5,599 parts In-Stock

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5,599

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SupplyDigital Components

Austria . 5,460 parts In-Stock

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5,460

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 2,527 parts In-Stock

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2,527

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Problanco Electronics

Mexico . 1,610 parts In-Stock

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1,610

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Corphita

USA . 783 parts In-Stock

1+ parts

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783

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Corohmni

South Africa . 358 parts In-Stock

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358

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UHIMA Technologies

Türkiye . 295 parts In-Stock

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295

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Overview

Discover the cutting-edge AR0331SRSC00XUEAH-GEVB by Onsemi, a high-quality sensor evaluation board that offers unparalleled performance and reliability. Manufactured by the industry leader Onsemi, this development board is perfect for a wide range of applications in image sensing technology. With its easy-to-use design and advanced features, customers can unlock endless possibilities in their projects. Experience the value and benefits of the AR0331SRSC00XUEAH-GEVB today and elevate your creations to the next level.

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers Evaluation Boards

This product is designed for evaluating the capabilities and performance of the AR0331 image sensor, making it suitable for development purposes.

Sensor Type: Image Sensor

Being an image sensor evaluation board, this product is specifically tailored for testing and optimizing image capture functionality.

Supplied Contents: Board(s)

The product includes the necessary board(s) for quickly setting up and testing the AR0331 image sensor, enabling a straightforward evaluation process.

Utilized IC / Part: AR0331SR

By utilizing the AR0331SR image sensor, this evaluation board offers compatibility and direct integration with this specific component, ensuring accurate evaluation results.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL rating of 1 (Unlimited) ensures that the board's performance and functionality will not be impacted by moisture exposure, providing reliability and durability in various environmental conditions.

Technical Specifications

Additional Parts AR0331SRSC00XUEAH-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0331SR

Standard Package:

1

Base Product Number:

AR0331

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0331SRSC00XUEAH-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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