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AR0331SRSC00SUCAH-GEVB

Onsemi

AR0331SRSC00SUCAH-GEVB by Onsemi

AR0331SRSC00SUCAH-GEVB by Onsemi is an Image Sensor Evaluation Board with AR0331SR IC. It comes in Bulk packaging and includes board(s). The sensor has Moisture Sensitivity Level of 1, making it suitable for development projects requiring high-quality image capture.

Median Price

$312.500

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$312.500

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2

$312.500

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Distributors (In-Stock)

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Vyrian

USA . 8,304 parts In-Stock

1+ parts

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8,304

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Digiode

USA . 2,412 parts In-Stock

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2,412

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Distributors (Availability)

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Native Components

USA . 414 parts In-Stock

1+ parts

$2.067

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414

$2.067

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Northwest PG Solutions

USA . 1,730 parts In-Stock

1+ parts

$2.274

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1,730

$2.274

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$16.450

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222

$16.450

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TANS Electronics

Latvia . 7,708 parts In-Stock

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7,708

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Problanco Electronics

Mexico . 5,964 parts In-Stock

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5,964

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Kulean Microsystems

USA . 5,089 parts In-Stock

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5,089

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Corphita

USA . 1,756 parts In-Stock

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1,756

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SupplyDigital Components

Austria . 1,642 parts In-Stock

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1,642

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Corohmni

South Africa . 191 parts In-Stock

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191

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UHIMA Technologies

Türkiye . 66 parts In-Stock

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66

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Overview

Unlock the potential of your imaging projects with the AR0331SRSC00SUCAH-GEVB from Onsemi, a leader in innovative semiconductor solutions. This versatile development board offers unmatched image quality and sensitivity, perfect for applications ranging from automotive to consumer electronics. Enjoy seamless integration and robust performance while benefiting from Onsemi's commitment to excellence and customer support. Elevate your designs and drive success with this reliable evaluation tool!

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers / Evaluation Boards

This wide category encompasses various applications, making the product suitable for a range of projects and facilitating easy integration into larger systems.

Sensor Type: Image Sensor

The image sensor type indicates that the product is capable of capturing high-quality visual data, essential for applications in imaging, security, and automation.

Packaging: Bulk

Bulk packaging is cost-effective for large projects, providing an economical solution for professionals and developers who require multiple units.

Supplied Contents: Board(s)

Supplied circuit boards enable immediate usage and prototyping, allowing developers to quickly start their projects without additional procurement.

Utilized IC / Part: AR0331SR

The AR0331SR part is known for its high performance and efficiency in image processing, ensuring reliable operation in demanding environments.

Base Product Number: AR0331

Having a standardized product number makes it easier to find supplementary components and resources, enhancing the development experience.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1, this product offers exceptional protection against moisture, making it suitable for various industrial applications without extensive handling precautions.

Technical Specifications

Additional Parts AR0331SRSC00SUCAH-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0331SR

Standard Package:

1

Base Product Number:

AR0331

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0331SRSC00SUCAH-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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