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AR0331SRSC00SHCAH-GEVB

Onsemi

AR0331SRSC00SHCAH-GEVB by Onsemi

AR0331SRSC00SHCAH-GEVB by Onsemi is an Image Sensor Evaluation Board with AR0331SR IC. It comes in Bulk packaging and includes the board(s). The sensor type is Image Sensor, base product number AR0331, MSL level 1. Ideal for evaluating image sensor performance in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,725 parts In-Stock

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4,725

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Digiode

USA . 2,354 parts In-Stock

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2,354

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Distributors (Availability)

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Native Components

USA . 270 parts In-Stock

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$5.245

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270

$5.245

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AZTECH Wire

Italy . 374 parts In-Stock

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$19.640

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374

$19.640

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TANS Electronics

Latvia . 5,993 parts In-Stock

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Kulean Microsystems

USA . 5,492 parts In-Stock

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Problanco Electronics

Mexico . 3,150 parts In-Stock

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3,150

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Northwest PG Solutions

USA . 1,763 parts In-Stock

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$5.140

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1,763

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$5.140

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Corphita

USA . 1,047 parts In-Stock

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1,047

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SupplyDigital Components

Austria . 674 parts In-Stock

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674

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UHIMA Technologies

Türkiye . 586 parts In-Stock

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586

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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$11.000

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$10.186

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$10.186

250

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$11.000

$10.186

$10.186

Corohmni

South Africa . 173 parts In-Stock

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173

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Overview

Unlock your next innovative project with the AR0331SRSC00SHCAH-GEVB from Onsemi, a trusted leader in cutting-edge sensor technology. This versatile evaluation board streamlines image sensor integration, enabling rapid prototyping and development for a range of applications, from smart cameras to automotive systems. Experience unmatched quality, reliability, and support from Onsemi as you elevate your designs and drive success in today's competitive landscape.

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers / Evaluation Boards

This category indicates that the product is designed for a wide range of applications, making it ideal for development and experimentation with various evaluation scenarios.

Sensor Type: Image Sensor

An image sensor is crucial for applications requiring high-quality imaging capabilities, making this product suitable for projects involving photography, video capture, and machine vision.

Packaging: Bulk

Bulk packaging is beneficial for projects requiring multiple units, offering cost efficiency and ease of use for developers needing several boards for larger projects.

Supplied Contents: Board(s)

Including the board in the supplied contents simplifies the setup process, allowing users to get started quickly with their projects without needing additional components.

Utilized IC / Part: AR0331SR

The use of the AR0331SR Integrated Circuit ensures compatibility with advanced imaging technologies, providing excellent performance in image processing tasks.

Base Product Number: AR0331

The AR0331 designation denotes a specific product line, ensuring that users can find support and resources tailored specifically for this model.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Having an MSL of 1 means that the product can be handled without the strict requirements of moisture control, making it more versatile for various environments during development.

Technical Specifications

Additional Parts AR0331SRSC00SHCAH-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0331SR

Standard Package:

1

Base Product Number:

AR0331

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0331SRSC00SHCAH-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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