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AR0141CS2M00SUEAH-GEVB

Onsemi

AR0141CS2M00SUEAH-GEVB by Onsemi

AR0141CS2M00SUEAH-GEVB by Onsemi is an Image Sensor Evaluation Board with AR0141CS IC. It comes in Bulk packaging and has MSL of 1. Ideal for testing image sensor performance in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,548 parts In-Stock

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Digiode

USA . 2,208 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 775 parts In-Stock

1+ parts

$0.048

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$0.046

775

$0.048

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$0.046

AZTECH Wire

Italy . 228 parts In-Stock

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$9.700

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228

$9.700

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Component Stockers USA

USA . 798 parts In-Stock

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$99.990

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798

$99.990

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Kulean Microsystems

USA . 8,048 parts In-Stock

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8,048

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Problanco Electronics

Mexico . 5,672 parts In-Stock

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TANS Electronics

Latvia . 3,356 parts In-Stock

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3,356

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SupplyDigital Components

Austria . 2,617 parts In-Stock

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2,617

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Corphita

USA . 1,366 parts In-Stock

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Northwest PG Solutions

USA . 1,286 parts In-Stock

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Corohmni

South Africa . 436 parts In-Stock

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436

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UHIMA Technologies

Türkiye . 393 parts In-Stock

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393

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Overview

Unlock the potential of your imaging projects with the AR0141CS2M00SUEAH-GEVB from Onsemi. Renowned for their commitment to innovation and quality, Onsemi delivers a powerful evaluation board designed to enhance image sensor applications in diverse fields like automotive, healthcare, and security. Experience seamless development, superior performance, and unmatched reliability that empower you to transform ideas into reality effortlessly. Elevate your designs today!

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers / Evaluation Boards

This product falls under a versatile category, making it suitable for various development applications, enhancing its usability for different projects.

Sensor Evaluation Boards

As a specific type of evaluation board, it is designed for evaluating sensor performance, making it ideal for developers working on image processing or sensor-related projects.

Packaging: Bulk

Being packaged in bulk allows for cost-effective purchasing, particularly beneficial for larger projects or institutions looking to buy in quantity.

Sensor Type: Image Sensor

The image sensor type signifies that this board is equipped for visual applications, making it perfect for projects involving imaging and video processing.

Supplied Contents: Board(s)

The inclusion of boards in the supplied contents means users have the essential hardware needed to begin evaluation and development immediately.

Utilized IC / Part: AR0141CS

Utilizing the AR0141CS IC provides advanced features and capabilities while ensuring compatibility with modern sensor applications, making it a robust choice for developers.

Base Product Number: AR0141

The base product number helps in identifying the specific model easily, aiding in making informed decisions for bulk purchases or replacements.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1, this product can withstand higher moisture levels, offering reliability in various environmental conditions, which is crucial for outdoor or humid applications.

Technical Specifications

Additional Parts AR0141CS2M00SUEAH-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0141CS

Standard Package:

1

Base Product Number:

AR0141

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0141CS2M00SUEAH-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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