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AR0135CS2M25SUEAH3-GEVB

Onsemi

AR0135CS2M25SUEAH3-GEVB by Onsemi

The Onsemi AR0135CS2M25SUEAH3-GEVB is a bulk-packaged Image Sensor Evaluation Board for the AR0135CS sensor. It has an MSL of 1 and includes board(s) for development purposes. Ideal for evaluating image sensor performance in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,862 parts In-Stock

1+ parts

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3,862

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Digiode

USA . 2,419 parts In-Stock

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2,419

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 808 parts In-Stock

1+ parts

$0.675

100+ parts

-

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808

$0.675

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Northwest PG Solutions

USA . 964 parts In-Stock

1+ parts

$0.743

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964

$0.743

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AZTECH Wire

Italy . 236 parts In-Stock

1+ parts

$19.340

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236

$19.340

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SupplyDigital Components

Austria . 6,831 parts In-Stock

1+ parts

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6,831

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Problanco Electronics

Mexico . 5,895 parts In-Stock

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5,895

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Corphita

USA . 2,182 parts In-Stock

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2,182

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Kulean Microsystems

USA . 2,152 parts In-Stock

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2,152

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TANS Electronics

Latvia . 1,825 parts In-Stock

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1,825

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UHIMA Technologies

Türkiye . 687 parts In-Stock

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687

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Corohmni

South Africa . 247 parts In-Stock

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247

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Overview

Experience the cutting-edge technology of Onsemi with the AR0135CS2M25SUEAH3-GEVB, a high-quality sensor evaluation board designed for image sensor applications. Onsemi is renowned for its innovation and reliability in the industry, making this product a must-have for developers and engineers looking to enhance their projects. With its versatile applications and superior performance, the AR0135CS2M25SUEAH3-GEVB offers unmatched value and benefits to customers seeking top-notch solutions for their imaging needs. Elevate your projects to the next level with Onsemi's exceptional development boards and kits.

Feature Benefit Bullets

Other Names: AR0135CS2M25SUEAH3-GEVB-ND

Easy to identify and order for customers looking for this specific evaluation board.

Category: Development Boards, Kits, Programmers

Provides a convenient platform for developers to evaluate and test the AR0135 image sensor.

Packaging: Bulk

Cost-effective packaging for those looking to purchase multiple boards for various projects.

Sensor Type: Image Sensor

Designed for evaluating the performance and capabilities of an image sensor, which can be crucial for camera-related projects.

Utilized IC / Part: AR0135CS

Utilizes the AR0135 image sensor to showcase its features and functionality in a practical setting.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for use in various environments without the risk of moisture damage, ensuring long-term reliability.

Technical Specifications

Additional Parts AR0135CS2M25SUEAH3-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

AR0135CS2M25SUEAH3-GEVB-ND
AR0135CS2M25SUEAH3-GEVBOS

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0135CS

Standard Package:

1

Base Product Number:

AR0135

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0135CS2M25SUEAH3-GEVB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8525.89.3000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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