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ADT7462ACPZ-R7

Onsemi

ADT7462ACPZ-R7 by Onsemi

ADT7462ACPZ-R7 by Onsemi is an 8-bit temperature sensor with a max supply voltage of 5.5V and accuracy of 4°C. It operates b/w -40°C to 125°C, making it ideal for applications requiring precise temperature monitoring in a compact square package. The sensor features a 4-wire interface and digital output, suitable for surface mount installations.

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Chip Stock

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Digiode

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France . 377 parts In-Stock

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Prism Electronics

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Nova Conductors

Japan . 17 parts In-Stock

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LWI Electronics Inc

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Aztec Data Supply Inc.

USA . 2,851 parts In-Stock

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AZTECH Wire

Italy . 270 parts In-Stock

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Ampacity Inc.

Singapore . 1,461 parts In-Stock

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Problanco Electronics

Mexico . 6,807 parts In-Stock

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Continental Prestige Electronics

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Glotronic Ltd.

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Argo Parts USA

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TANS Electronics

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UHIMA Technologies

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Overview

Discover the cutting-edge technology of the ADT7462ACPZ-R7 temperature sensor by Onsemi, a leading manufacturer known for top-quality products. Perfect for a wide range of applications, this sensor offers unparalleled accuracy and reliability, ensuring precise temperature monitoring in any environment. With a compact design and easy installation, this sensor provides value and peace of mind to customers looking for a dependable solution. Upgrade your system with the ADT7462ACPZ-R7 and experience the benefits of superior temperature sensing technology.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage allows for flexibility in power supply options, making it suitable for various applications.

No. of Bits: 8

With 8 bits of resolution, this temperature sensor can provide precise temperature measurements for accurate monitoring and control.

Body Width: 5 inch

The compact size of 5 inch body width makes it easy to integrate this sensor into tight spaces or on small devices.

Sensors or Transducers Type: TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

This sensor offers multiple output options, allowing for versatile integration with different systems and interfaces.

Body Height: 0.9 mm

The low profile of 0.9 mm body height ensures minimal obstruction and easy placement in applications with space constraints.

Package Shape or Style: SQUARE

The square package shape provides a stable and secure mounting option, ensuring reliability in various environments.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3 V enables operation in energy-efficient or battery-powered systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this sensor can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 125°C allows for reliable operation in both freezing cold and high-temperature environments.

Terminal Finish: Tin (Sn)

The tin terminal finish ensures good solderability and long-term stability in various applications.

Maximum Operating Current: 4 mA

The low maximum operating current of 4 mA helps in minimizing power consumption and heat generation for efficient operation.

Maximum Accuracy °C: 4

With an accuracy of 4°C, this sensor provides reliable and precise temperature measurements for critical applications.

Body Length/Diameter: 5 mm

The small body length of 5 mm enables easy integration and placement in compact devices or installations.

Termination Type: SOLDER

The solder termination type ensures secure and reliable electrical connections for stable performance and durability.

Output Interface Type: 4-WIRE INTERFACE

The 4-wire interface type allows for easy and reliable communication with external systems for seamless integration and data exchange.

Mounting Feature: SURFACE MOUNT

The surface mounting feature enables simple and secure installation on PCBs or other surfaces, facilitating quick and hassle-free deployment.

Technical Specifications

Temperature Sensors ADT7462ACPZ-R7 attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

4

Additional Features:

HYSTERESIS IS 0.07V

Body Width:

5 inch

Body Height:

.9 mm

Body Length/Diameter:

5 mm

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

8

Maximum Operating Current:

4 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

4-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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