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ADT7461AARMZ-002

Onsemi

ADT7461AARMZ-002 by Onsemi

ADT7461AARMZ-002 by Onsemi is an 8-bit temperature sensor with a max supply voltage of 3.6V and accuracy of 2.5 °C. It operates b/w -40 to 125°C, suitable for applications requiring precise temperature monitoring in compact spaces like consumer electronics and industrial equipment.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,835 parts In-Stock

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Digiode

USA . 1,167 parts In-Stock

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Native Components

USA . 917 parts In-Stock

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$1.390

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$1.390

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Northwest PG Solutions

USA . 795 parts In-Stock

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$1.529

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AZTECH Wire

Italy . 61 parts In-Stock

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$18.060

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Kulean Microsystems

USA . 7,985 parts In-Stock

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TANS Electronics

Latvia . 3,169 parts In-Stock

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SupplyDigital Components

Austria . 2,558 parts In-Stock

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Corphita

USA . 1,126 parts In-Stock

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UHIMA Technologies

Türkiye . 257 parts In-Stock

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Problanco Electronics

Mexico . 231 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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Overview

Enhance your temperature sensing capabilities with the ADT7461AARMZ-002 by Onsemi. This high-quality temperature sensor offers unparalleled accuracy and reliability, making it the perfect choice for a wide range of applications. With its compact size and advanced features, this sensor is ideal for monitoring and controlling temperature in various electronic devices. Trust Onsemi's reputation for excellence and invest in the ADT7461AARMZ-002 today to experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options and compatibility with various systems.

No. of Bits: 8

Provides sufficient resolution for accurate temperature measurements.

Body Width: 3 inch

Compact size allows for easy integration into different equipment or systems.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor types provide flexibility in how data is collected and output.

Body Height: 1.1 mm

Low profile design makes it suitable for applications with space constraints.

Package Shape or Style: SQUARE

Square shape enables easy placement and mounting on circuit boards.

Minimum Supply Voltage: 3 V

Operates efficiently at low voltage levels, saving power and reducing heat generation.

Maximum Operating Temperature: 125 °C

Capable of measuring high temperature ranges, making it suitable for various industrial applications.

Minimum Operating Temperature: -40 °C

Able to operate in extreme cold conditions, increasing its usability in different environments.

Terminal Finish: Tin (Sn)

Tin finish provides good conductivity and corrosion resistance for reliable performance.

Maximum Operating Current: 0.35 mA

Low operating current ensures energy efficiency and prevents overheating.

Maximum Accuracy °C: 2.5

High level of accuracy ensures precise temperature measurements for critical applications.

Body Length/Diameter: 3 mm

Compact size allows for easy installation and integration into different systems.

Termination Type: SOLDER

Solder termination provides secure connections, enhancing the sensor's reliability.

Output Interface Type: 2-WIRE INTERFACE

Two-wire interface simplifies connectivity and communication with other devices or systems.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure attachment to circuit boards.

Technical Specifications

Temperature Sensors ADT7461AARMZ-002 attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

2.5

Additional Features:

HYSTERESIS IS 0.5V

Body Width:

3 inch

Body Height:

1.1 mm

Body Length/Diameter:

3 mm

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

8

Maximum Operating Current:

.35 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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