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ADM1027ARQZ-RL7

Onsemi

ADM1027ARQZ-RL7 by Onsemi

ADM1027ARQZ-RL7 by Onsemi is a Power Management IC with 24 terminals, operating at 3.3V/5V. It has a small outline package style and supports power supply circuits. With an adjustable threshold, it can handle up to 5.5V supply voltage, making it ideal for various applications requiring precise power management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,821 parts In-Stock

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Digiode

USA . 944 parts In-Stock

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AZTECH Wire

Italy . 148 parts In-Stock

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$16.930

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Microchip USA

USA . 5,874 parts In-Stock

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Problanco Electronics

Mexico . 5,300 parts In-Stock

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TANS Electronics

Latvia . 3,135 parts In-Stock

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Corphita

USA . 1,987 parts In-Stock

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Northwest PG Solutions

USA . 863 parts In-Stock

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SupplyDigital Components

Austria . 528 parts In-Stock

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Corohmni

South Africa . 230 parts In-Stock

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Native Components

USA . 202 parts In-Stock

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UHIMA Technologies

Türkiye . 113 parts In-Stock

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Kulean Microsystems

USA . 67 parts In-Stock

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Overview

Enhance your power management solutions with the ADM1027ARQZ-RL7 by Onsemi. Manufactured with top-quality materials and advanced technology, this Power Management IC offers unmatched efficiency and reliability for a wide range of applications. With its compact design and versatile features, this product provides customers with a valuable solution that ensures optimal performance and seamless operation. Upgrade your power management system today with the ADM1027ARQZ-RL7 and experience the benefits of superior quality and innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with various devices that require a 3.3V power supply, making it versatile for different applications.

No. of Terminals: 24

Provides ample connectivity options for a wide range of devices, allowing for flexibility in circuit design.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for use in potentially hot environments without compromising performance.

Minimum Operating Temperature: 0 °C

Operates effectively in colder temperatures, ensuring reliable performance in various environmental conditions.

Maximum Seated Height: 1.75 mm

Compact and low-profile design allows for efficient use of space in compact devices or tight circuit layouts.

No. of Channels: 9

Provides multiple channels for power distribution or regulation, enabling the product to support multiple devices simultaneously.

Terminal Pitch: 0.635 mm

Close terminal pitch allows for efficient routing of connections on a circuit board, reducing signal interference and improving overall performance.

Technical Specifications

Power Management ICs ADM1027ARQZ-RL7 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

IT CAN ALSO OPERATE FROM A 5V NOMINAL SUPPLY

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

8.6614 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

9

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width (mm):

3.9116 mm

Trade Compliance

ADM1027ARQZ-RL7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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