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7WB383BMX1TCG

Onsemi

7WB383BMX1TCG by Onsemi

7WB383BMX1TCG by Onsemi is a single-ended multiplexer with 8 terminals in a rectangular grid array package. It features nickel/palladium/gold terminal finish and is surface mountable. Ideal for applications requiring high-performance switching in compact electronic devices.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,990 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

5,990

-

$0.238

$0.197

$0.176

Verical

USA . 5,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.247

5,990

-

-

-

$0.247

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,379 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

2,379

$0.185

-

-

-

Vyrian

USA . 4,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,264

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 82 parts In-Stock

1+ parts

$0.169

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$0.169

-

-

-

Corphita

USA . 1,710 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$0.176

-

-

-

AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$19.400

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$19.400

-

-

-

Continental Prestige Electronics

USA . 5,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.175

10k+ parts

-

5,990

-

-

$0.175

-

Problanco Electronics

Mexico . 4,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,569

-

-

-

-

TANS Electronics

Latvia . 2,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,114

-

-

-

-

Northwest PG Solutions

USA . 1,446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,446

-

-

-

-

SupplyDigital Components

Austria . 1,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,242

-

-

-

-

Kulean Microsystems

USA . 1,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,185

-

-

-

-

UHIMA Technologies

Türkiye . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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770

-

-

-

-

Native Components

USA . 455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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455

-

-

-

-

Microchip USA

USA . 324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

324

-

-

-

-

Overview

Discover endless possibilities with the 7WB383BMX1TCG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This multiplexer offers a wide range of applications, making it versatile and suitable for various projects. With its advanced features and durable construction, customers can trust in the value and benefits that this product brings to their work. Upgrade your projects with the 7WB383BMX1TCG and experience the advantages firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving time and space.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs and layouts.

No. of Terminals: 8

8 terminals provide versatility in connecting multiple input and output signals.

Package Style (Meter): GRID ARRAY

Grid array package style ensures a compact form factor and efficient use of space on the PCB.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and connection to the PCB for hassle-free installation.

Other IC type: SINGLE-ENDED MULTIPLEXER

Single-ended multiplexer design simplifies signal routing and management for efficient signal processing.

Terminal Form: BUTT

Butt terminal form ensures secure and stable connections for reliable performance in various applications.

Technical Specifications

Multiplexers & Switches 7WB383BMX1TCG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PBGA-BU8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Trade Compliance

7WB383BMX1TCG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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