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74HC595DTR2G

Onsemi

74HC595DTR2G by Onsemi

74HC595DTR2G by Onsemi is an 8-bit digital shift register with a propagation delay of 210ns. Operating at a frequency of 4MHz, it has a supply voltage range of 2-6V and operates b/w -55 to 125 °C. Ideal for applications requiring true output polarity and positive edge triggering in military-grade environments.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 163 parts In-Stock

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-

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$0.159

1k+ parts

$0.132

10k+ parts

$0.117

163

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$0.159

$0.132

$0.117

Distributors (In-Stock)

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Digiode

USA . 971 parts In-Stock

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$0.124

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$0.124

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DF Sales Co.

USA . 400 parts In-Stock

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$0.500

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$0.500

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DF Sales Co.

USA . 400 parts In-Stock

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$0.500

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$0.500

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Chip Stock

USA . 960,620 parts In-Stock

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Vyrian

USA . 3,622 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,384 parts In-Stock

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$0.117

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Component Stockers USA

USA . 194 parts In-Stock

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$0.130

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$0.130

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Corohmni

South Africa . 88 parts In-Stock

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$0.130

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AZTECH Wire

Italy . 695 parts In-Stock

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$16.300

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SupplyDigital Components

Austria . 6,939 parts In-Stock

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TANS Electronics

Latvia . 6,684 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,029 parts In-Stock

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Kulean Microsystems

USA . 4,897 parts In-Stock

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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Northwest PG Solutions

USA . 1,499 parts In-Stock

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Problanco Electronics

Mexico . 950 parts In-Stock

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Native Components

USA . 782 parts In-Stock

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UHIMA Technologies

Türkiye . 454 parts In-Stock

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Microchip USA

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Kepictronics

USA . 50 parts In-Stock

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Overview

Experience seamless integration and unmatched quality with the 74HC595DTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers digital shift registers that excel in performance and reliability. Perfect for applications requiring precise data storage and transfer, this product offers customers exceptional value and benefits. Upgrade your projects with ease and efficiency using the 74HC595DTR2G and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the shift register, making it suitable for various applications.

Surface Mount: YES

Allows for easy and convenient PCB assembly, reducing manufacturing time and costs.

No. of Bits: 8

Provides sufficient capacity for data storage and processing in a variety of digital applications.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard voltage level, ensuring compatibility with common power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, optimizing performance.

Technical Specifications

Digital Shift Registers 74HC595DTR2G attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74HC595DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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