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PCA9554BS3

NXP Semiconductors

PCA9554BS3 by NXP Semiconductors

PCA9554BS3 from NXP Semiconductors is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features a compact square package and operates in temperatures from -40 °C to 85 °C. This CMOS device supports surface mount technology for efficient integration.

Median Price

$4.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,976 parts In-Stock

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$4.940

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Flip Electronics

USA . 5,920 parts In-Stock

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Digiode

USA . 4,135 parts In-Stock

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4,135

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Anansix

USA . 2,846 parts In-Stock

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2,846

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One Stop Electronics

USA . 999 parts In-Stock

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$25.000

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999

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Corohmni

South Africa . 65 parts In-Stock

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$52.371

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65

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UNI Independent Distributors

Spain . 7,637 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,081 parts In-Stock

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Metaverse IC Inc.

Canada . 1,319 parts In-Stock

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Corphita

USA . 171 parts In-Stock

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Overview

Unlock the potential of your designs with the PCA9554BS3 from NXP Semiconductors—where quality meets innovation! This versatile parallel I/O port enhances your projects with reliable performance and durability across a wide temperature range. With its compact, surface-mount design, it's perfect for industrial applications that demand precision. Trust in NXP's legacy of excellence to elevate your solutions, ensuring seamless connectivity and efficiency every step of the way!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material provides excellent protection against environmental factors, ensuring reliability.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

The ability to handle up to 5.5V makes this product versatile for various applications.

Package Shape: SQUARE

Square package shape optimizes space on the PCB, allowing for efficient layout and placement.

No. of Bits: 8

With 8 bits, this device can handle a wide range of data communication tasks effectively.

Power Supplies (V): 2.5/5

Supports dual supply voltage levels, enhancing compatibility with different systems.

No. of Terminals: 16

Having 16 terminals allows for greater connectivity and expanded functionality within your system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Very thin profile allows integration into space-constrained applications without sacrificing performance.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage ensures operation in low power environments, making it energy-efficient.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance allows for use in demanding industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finish enhances conductivity and reduces wear over time, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal positioning provides a better layout for routing signals on the PCB.

Maximum Seated Height: 1 mm

Low seated height minimizes space requirements on the PCB, ideal for compact device designs.

Width: 3 mm

Narrow width aids in fitting into tight spaces on circuit boards while maintaining performance.

Maximum Time At Peak Reflow Temperature: 30 s

Allows for quick and efficient manufacturing processes, optimizing production turnaround times.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability ensures compatibility with advanced soldering techniques.

Length: 3 mm

Compact length helps in creating smaller, more complex circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product provides reliability and stability in varied environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile peripheral IC type makes it suitable for numerous applications, ranging from data transfer to control tasks.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: NO LEAD

No lead design promotes easier handling and reduces the risk of damage during assembly.

Nominal Supply Voltage: 3 V

Optimized for nominal 3V operation, making it an ideal choice for battery-powered applications.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for a more compact design, facilitating denser PCB layouts.

No. of I/O Lines: 8

With 8 I/O lines, it supports a diverse range of input/output operations, enhancing functionality.

Technical Specifications

Parallel I/O Ports PCA9554BS3 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Trade Compliance

PCA9554BS3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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