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UDA1330ATS

NXP Semiconductors

UDA1330ATS by NXP Semiconductors

D/A CONVERTER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,020 parts In-Stock

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Vyrian

USA . 1,312 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 583 parts In-Stock

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Anansix

USA . 495 parts In-Stock

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495

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EMSNET

USA . 116 parts In-Stock

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Connector Distribution Corp

USA . 60 parts In-Stock

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60

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Right Parts Inc.

USA . 60 parts In-Stock

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60

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Distributors (Availability)

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One Stop Electronics

USA . 793 parts In-Stock

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GreenTree Electronics

Israel . 8,320 parts In-Stock

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Corphita

USA . 4,566 parts In-Stock

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UNI Independent Distributors

Spain . 4,451 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,369 parts In-Stock

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Kepictronics

USA . 2,328 parts In-Stock

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Technical Specifications

Digital-to-Analog Converters UDA1330ATS attributes and parameters. Explore more Digital-to-Analog Converters devices from NXP Semiconductors

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

No. of Bits:

20

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.205 in (5.2 mm)

Maximum Seated Height:

0.059 in (1.5 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

Trade Compliance

UDA1330ATS Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-617-0306, 5962016170306

NIIN

016170306

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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