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UBA3077HN

NXP Semiconductors

UBA3077HN by NXP Semiconductors

UBA3077HN by NXP Semiconductors is a square, no-lead LED display driver in a 40-terminal chip carrier package. It features surface mount technology and is ideal for graphics display applications. This driver ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,081

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-

-

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Vyrian

USA . 1,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,977

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Anansix

USA . 278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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278

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,457 parts In-Stock

1+ parts

$25.500

100+ parts

-

1k+ parts

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10k+ parts

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1,457

$25.500

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Corphita

USA . 1,086 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,086

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UNI Independent Distributors

Spain . 583 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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583

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Overview

Transform your visual displays with the UBA3077HN from NXP Semiconductors, a leader in innovative electronics. This advanced graphics display driver not only ensures stunning image quality but also offers seamless integration and reliability for a range of applications—from consumer electronics to industrial devices. Experience enhanced performance, energy efficiency, and effortless design flexibility that elevate your project and captivate your audience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good protection against environmental stress, making the product durable and suitable for a variety of applications.

Surface Mount: YES

Being a surface mount device allows for easy integration into modern PCB designs, saving space and improving the overall design efficiency.

Package Shape: SQUARE

The square package shape helps optimize layout on a circuit board, allowing for better packing density and performance in compact electronic designs.

No. of Terminals: 40

With 40 terminals, this product provides a robust connection for a variety of functions, enhancing flexibility in design and enabling support for complex applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style facilitates better heat dissipation, which is important for performance stability in high-demand applications.

Terminal Position: QUAD

The quad terminal position improves accessibility for soldering and connection, ensuring ease of installation and maintenance.

Terminal Form: NO LEAD

Being a no-lead device minimizes space and enhances soldering efficiency, which is particularly beneficial in high-density applications.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this product is specifically designed for driving LED displays, ensuring high-quality visual output and reliable performance.

Technical Specifications

Graphics Display Drivers UBA3077HN attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

UBA3077HN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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