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UBA2037TS/N1,118

NXP Semiconductors

UBA2037TS/N1,118 by NXP Semiconductors

UBA2037TS/N1,118 by NXP Semiconductors is a robust MOSFET gate driver designed for automotive applications. It operates within -40 °C to 125 °C, supports a nominal voltage of 12V, and features a compact 28-terminal gull-wing package. Ideal for efficient power management in automotive systems.

Median Price

$1.515

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,244 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.280

10k+ parts

$1.210

4,244

-

$1.430

$1.280

$1.210

Verical

USA . 3,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.600

10k+ parts

$1.512

3,800

-

-

$1.600

$1.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,523 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

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3,523

$1.510

-

-

-

Vyrian

USA . 2,527 parts In-Stock

1+ parts

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2,527

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-

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Anansix

USA . 864 parts In-Stock

1+ parts

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864

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

1+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,688 parts In-Stock

1+ parts

$1.431

100+ parts

-

1k+ parts

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10k+ parts

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3,688

$1.431

-

-

-

Microchip USA

USA . 236 parts In-Stock

1+ parts

$2.321

100+ parts

-

1k+ parts

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236

$2.321

-

-

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$17.140

100+ parts

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1k+ parts

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483

$17.140

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 6,214 parts In-Stock

1+ parts

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6,214

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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UNI Independent Distributors

Spain . 2,308 parts In-Stock

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2,308

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Perfect Parts

USA . 45 parts In-Stock

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45

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Cyclops Electronics Ltd (Excess)

UK . 20 parts In-Stock

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20

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Overview

Elevate your designs with the UBA2037TS/N1,118 from NXP Semiconductors, a leader in reliable and innovative solutions. This advanced MOSFET Gate Driver ensures robust performance in diverse applications, from automotive systems to industrial controls. With its high operational temperature range and compact design, it guarantees efficiency and flexibility, making it an ideal choice for engineers seeking quality and durability. Trust in NXP's legacy of excellence to power your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in diverse application environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, making it suitable for modern electronic assemblies.

Package Shape: RECTANGULAR

A rectangular package shape optimizes power dissipation and enhances thermal management, critical for high-performance applications.

Power Supplies (V): 12

Operating at 12V power supply is standard for many electronic systems, simplifying integration into existing designs.

No. of Terminals: 28

With 28 terminals, this driver accommodates complex connections and functionalities, ideal for advanced circuit designs.

Package Style: SMALL OUTLINE, SHRINK PITCH

This style allows for higher density mounting on PCBs while supporting more efficient electrical performance.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature automotive environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C makes it suitable for harsh environmental conditions, enhancing versatility.

Terminal Position: DUAL

Dual terminal positioning aids in effective thermal management and facilitates easier PCB layout designs.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, increasing manufacturability.

Temperature Grade: AUTOMOTIVE

Being rated for automotive applications guarantees robustness and reliability in critical automotive electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and solderability, ensuring reliable connections on the PCB.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V aligns with common automotive electrical systems, facilitating easier integration.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm supports high-density designs, making it suitable for compact applications.

Technical Specifications

MOSFET Gate Drivers UBA2037TS/N1,118 attributes and parameters. Explore more MOSFET Gate Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

MOSFET Drivers

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UBA2037TS/N1,118 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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