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UBA2015T/N1

NXP Semiconductors

UBA2015T/N1 by NXP Semiconductors

UBA2015T/N1 by NXP Semiconductors is a vacuum fluorescent display driver designed for automotive applications. It operates within -40 °C to 125 °C, features a 9V nominal voltage, and comes in a compact 20-terminal package. Ideal for graphics displays, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,718 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,718

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-

-

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Anansix

USA . 1,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,780

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-

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Digiode

USA . 839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

839

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 815 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

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815

$8.500

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Corphita

USA . 2,454 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,454

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UNI Independent Distributors

Spain . 1,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,519

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-

-

-

Overview

Elevate your display technology with the UBA2015T/N1 from NXP Semiconductors, a leader in innovation and quality. Designed for automotive applications, this robust graphics display driver ensures reliability even in extreme conditions, enhancing visibility and performance. Its compact design and advanced features deliver seamless integration, making it the perfect choice for forward-thinking manufacturers seeking superior visual solutions. Experience unmatched value, efficiency, and longevity with NXP's trusted expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures long-lasting performance and reliability in automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

Rectangular package shape optimizes the use of space on printed circuit boards while maintaining efficient thermal performance.

No. of Terminals: 20

With 20 terminals, this driver provides ample connectivity options for integrating into complex display systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables easy mounting and saves valuable board space, making it ideal for compact devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can operate reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in extreme conditions, making it suitable for automotive applications.

Terminal Position: DUAL

Dual terminal positioning enhances the flexibility of PCB layout and can improve electrical performance.

Maximum Seated Height: 2.65 mm

The low seated height allows for a low-profile design, which is advantageous for systems with height restrictions.

Width: 7.5 mm

A width of 7.5 mm makes it compact and easy to fit into a variety of device designs.

Length: 12.8 mm

The length of 12.8 mm contributes to the overall compactness of the driver, facilitating efficient board design.

Temperature Grade: AUTOMOTIVE

Classified for automotive use, this driver is built to withstand the rigors of vehicle environments, ensuring durability.

Terminal Form: GULL WING

Gull wing terminals provide excellent electrical connectivity and ease of soldering, enhancing manufacturing efficiency.

Nominal Supply Voltage: 9 V

The nominal supply voltage of 9 V is compatible with a wide range of automotive and electronic systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density layouts, accommodating modern compact PCB designs.

Interface IC Type: VACUUM FLUORESCENT DISPLAY DRIVER

Designed specifically for driving vacuum fluorescent displays, this IC type ensures optimal performance and efficient operation in display applications.

Technical Specifications

Graphics Display Drivers UBA2015T/N1 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

UBA2015T/N1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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