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TL431ASDT,215

NXP Semiconductors

TL431ASDT,215 by NXP Semiconductors

THREE TERMINAL VOLTAGE REFERENCE; Temperature Grade: AUTOMOTIVE; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.106

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,028 parts In-Stock

1+ parts

-

100+ parts

$0.106

1k+ parts

$0.088

10k+ parts

$0.078

1,028

-

$0.106

$0.088

$0.078

Distributors (In-Stock)

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Digiode

USA . 1,631 parts In-Stock

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$0.083

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-

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1,631

$0.083

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Vyrian

USA . 6,605 parts In-Stock

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6,605

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Anansix

USA . 839 parts In-Stock

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839

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Corphita

USA . 1,683 parts In-Stock

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$0.078

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1,683

$0.078

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Microchip USA

USA . 181 parts In-Stock

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$0.352

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181

$0.352

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AZTECH Wire

Italy . 976 parts In-Stock

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$13.760

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976

$13.760

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,739 parts In-Stock

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UNI Independent Distributors

Spain . 522 parts In-Stock

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Perfect Parts

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Technical Specifications

Voltage References TL431ASDT,215 attributes and parameters. Explore more Voltage References devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

5.015 V

Minimum Output Voltage:

.025 V

Nominal Output Voltage:

2.495 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

2.495 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

888 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

YES

Width (mm):

1.3 mm

Trade Compliance

TL431ASDT,215 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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