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TJA1145ATK

NXP Semiconductors

TJA1145ATK by NXP Semiconductors

CAN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,549

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-

-

-

Digiode

USA . 2,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,884

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Anansix

USA . 484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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484

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 795 parts In-Stock

1+ parts

$73.000

100+ parts

-

1k+ parts

-

10k+ parts

-

795

$73.000

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Corphita

USA . 4,436 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,436

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UNI Independent Distributors

Spain . 4,345 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,345

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Technical Specifications

Network Interfaces TJA1145ATK attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

65 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TJA1145ATK Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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