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TJA1128ATK/0Z

NXP Semiconductors

TJA1128ATK/0Z by NXP Semiconductors

ANALOG CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;

Median Price

$0.937

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 6,000 parts In-Stock

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Verical

USA . 6,000 parts In-Stock

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$0.937

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Chip Stock

USA . 100,000 parts In-Stock

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Martec Srl

Italy . 44,157 parts In-Stock

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Flip Electronics

USA . 9,305 parts In-Stock

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Vyrian

USA . 4,463 parts In-Stock

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Digiode

USA . 3,318 parts In-Stock

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Anansix

USA . 1,715 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 7,472 parts In-Stock

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$5.707

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AZTECH Wire

Italy . 96 parts In-Stock

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$19.570

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UNI Independent Distributors

Spain . 4,902 parts In-Stock

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Corphita

USA . 3,836 parts In-Stock

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Technical Specifications

Other Function Semiconductors TJA1128ATK/0Z attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TJA1128ATK/0Z Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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