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TJA1055T/3,518

NXP Semiconductors

TJA1055T/3,518 by NXP Semiconductors

NXP Semiconductors' TJA1055T/3,518 is a network interface IC with 14 terminals in a small outline package. It operates at a nominal voltage of 5V and has a terminal pitch of 1.27mm. This interface circuit is commonly used in telecom applications for data communication purposes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,818 parts In-Stock

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Digiode

USA . 1,695 parts In-Stock

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1,695

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Anansix

USA . 1,079 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 218 parts In-Stock

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$5.224

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218

$5.224

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Microchip USA

USA . 337 parts In-Stock

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$9.902

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337

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Aztec Data Supply Inc.

USA . 2,168 parts In-Stock

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$13.090

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$13.090

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Corohmni

South Africa . 153 parts In-Stock

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$15.056

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153

$15.056

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Ampacity Inc.

Singapore . 1,477 parts In-Stock

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$59.000

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$59.000

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Semicontronic

India . 1,634 parts In-Stock

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$528.000

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$514.800

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$512.160

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1,634

$528.000

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One Stop Electronics

USA . 341 parts In-Stock

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$743.000

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341

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Continental Prestige Electronics

USA . 3,835 parts In-Stock

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UNI Independent Distributors

Spain . 2,758 parts In-Stock

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Argo Parts USA

USA . 1,943 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Corphita

USA . 520 parts In-Stock

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520

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Overview

Unlock seamless communication and unparalleled connectivity with the TJA1055T/3,518 by NXP Semiconductors. Crafted with precision and expertise, this network interface boasts a cutting-edge design that guarantees top-notch performance in various applications. From automotive to industrial settings, this innovative product ensures reliability and efficiency, making it a must-have for customers seeking superior quality and unmatched value. Experience the difference with NXP Semiconductors and take your projects to new heights with the TJA1055T/3,518.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material ensures durability and lightweight design, making it easy to integrate into various devices.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and flexibility in networking setups.

Maximum Seated Height: 1.75 mm

Low seated height enables compact and slim designs for devices where space is a constraint.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes it compatible with a wide range of devices and power sources.

Technical Specifications

Network Interfaces TJA1055T/3,518 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TJA1055T/3,518 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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