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TJA1040T/H/V,518

NXP Semiconductors

TJA1040T/H/V,518 by NXP Semiconductors

NXP Semiconductors' TJA1040T/H/V,518 is a CMOS interface circuit with 8 terminals and 5V supply voltage. It operates at temperatures from -40 to 125°C, supporting data rates up to 1 Mbps. Designed for automotive applications, it features a small outline package suitable for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,879 parts In-Stock

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Vyrian

USA . 2,095 parts In-Stock

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Anansix

USA . 1,743 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 623 parts In-Stock

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$9.753

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623

$9.753

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Aztec Data Supply Inc.

USA . 3,233 parts In-Stock

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$12.960

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Corohmni

South Africa . 69 parts In-Stock

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$17.628

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69

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Microchip USA

USA . 132 parts In-Stock

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$18.478

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132

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Ampacity Inc.

Singapore . 932 parts In-Stock

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$288.000

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932

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One Stop Electronics

USA . 1,624 parts In-Stock

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$450.000

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$450.000

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Semicontronic

India . 995 parts In-Stock

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$674.000

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$657.150

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$653.780

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995

$674.000

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$653.780

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Corphita

USA . 4,915 parts In-Stock

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UNI Independent Distributors

Spain . 3,340 parts In-Stock

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Argo Parts USA

USA . 1,085 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Continental Prestige Electronics

USA . 609 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance your automotive networking solutions with the high-quality TJA1040T/H/V,518 by NXP Semiconductors. This network interface offers reliable performance and seamless connectivity, making it ideal for a wide range of applications in the automotive industry. With its compact design and advanced technology, this product ensures efficient data transfer at a maximum speed of 1 Mbps. Trust NXP Semiconductors to deliver cutting-edge solutions that provide value, benefits, and advantages to customers looking to enhance their automotive systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and durable, ensuring a long-lasting and reliable network interface.

Surface Mount: YES

The ability to surface mount the product allows for easy installation on circuit boards, saving space and enhancing efficiency.

Terminal Position: DUAL

Dual terminal position provides flexibility in connectivity options, allowing for versatile integration in various network setups.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade, this product can withstand extreme temperature conditions, making it suitable for automotive applications.

Data Rate: 1 Mbps

The high data rate of 1 Mbps ensures fast and efficient data transfer, ideal for high-speed networking requirements.

Technical Specifications

Network Interfaces TJA1040T/H/V,518 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

75 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1040T/H/V,518 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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