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TEA1566J

NXP Semiconductors

TEA1566J by NXP Semiconductors

AC-DC REGULATED POWER SUPPLY MODULE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR; Surface Mount: NO; Maximum Output Current: 7 A;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,079 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,079

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Anansix

USA . 1,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,406

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Digiode

USA . 875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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875

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,210 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,210

$3.500

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UNI Independent Distributors

Spain . 4,521 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,521

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Corphita

USA . 2,140 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,140

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Technical Specifications

Power Supply Modules TEA1566J attributes and parameters. Explore more Power Supply Modules devices from NXP Semiconductors

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PZIP-T9

Length:

23.8 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

9

Maximum Output Current:

7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP9,.1,100

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

17 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Maximum Switching Frequency:

30.5 kHz

Technology:

BCDMOS

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

ZIG-ZAG

Trim or Adjustable Output (V):

YES

Width (mm):

4.4 mm

Trade Compliance

TEA1566J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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